Spec. No. JEFL243C-9122-01 P 10/11
MURATA MFG CO., LTD.
Reference Only
〈Flow〉
Standard Profile Limit Profile
Pre-heating
150°C
, 60s min.
Heating
250°C
, 4~6s 265±3°C, 5s max.
Cycle of flow 2 times 2 times
(3)Printing of Adhesive (Flow Soldering)
Adhesive amount should be around 0.5mg /a chip.
-To get enough bonding strength
- To avoid spreading of adhesive onto a land. Because soldering failure may be caused by adhesive
on the land.
The adhesive position is as follows.
14.9 Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being mounted
by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
14.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
14.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
14.12 Operating Environment
Do not use this product under the following environmental conditions,on deterioration of the performance,
such as inslation resistance may result from the use.
(1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent,may splash on the products.
150
60s min. Time(s)
265±3℃
Temp.
(℃)
Standard Profile
250℃
Limit Profile
Heating Time
接着剤塗布位置
adhesive