Spec. No. JEFL243C-9122-01 P 7/11
MURATA MFG CO., LTD.
Reference Only
14. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
14.1 Flux and Solder
Flux
Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
14.2 Assembling
Products can be applied to reflow and flow soldering.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C max. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body.
14.3 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ I max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1. Cleaner
·Isopropyl alcohol (IPA)
2.Aqueous agent
·PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
14.4 Resin coating
The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An
open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
14.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
［Products direction］
Products shall be location the sideways
direction (Length:a
<b) to the mechanical
stress.
〈
Poor example
〉
〈
Good example
〉
b
a
