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PLA193

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R06
PLA193
PERFORMANCE DATA (@25ºC Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
5
10
15
20
25
30
35
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=60mA)
AC/DC Configuration
DC-Only Configuration
Voltage(V)
0.0 0.5 1.0 1.5 2.0
Current (A)
0.00
0.05
0.10
0.15
0.20
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=5mA)
Voltage(V)
-3 -2 -1 0 1 2 3
Current (A)
-0.10
-0.05
0.00
0.05
0.10
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
60
80
100
120
140
160
180
200
Maximum Load Current
vs. Temperature
(I
F
=5mA)
DC-Only Configuration
AC/DC Configuration
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (V
P
)
640
660
680
700
720
740
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
20
40
60
80
100
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(V
L
=600V
P
)
Output Voltage (V)
1 10 100 1000
Output Capacitance (pF)
0
10
20
30
40
50
60
70
80
Output Capacitance vs. Load Voltage
(I
F
=0mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100 1 10 100
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve
I
NTEGRATED
C
IRCUITS
D
IVISION
PLA193
www.ixysic.com
5
R06
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
All Versions MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
All Versions 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. IXYS Integrated Circuits Division employs the use of silicone coating as an optical
waveguide in the standard PLA193 (without the "E" suffix); the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. The E-suffix product, being of double-molded construction, does not have
the same necessity for a drying bake. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning
methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R06
PLA193
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
MECHANICAL DIMENSIONS
PLA193 & PLA193E
PLA193S & PLA193ES
P1-P3P4-P6P7-P7

PLA193

Mfr. #:
Buy PLA193
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount SPST-NO 6PIN DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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