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the device to the all-off state and a high impedance (Z)
state for normal operation. This requires the use of an
open-collector or open-drain type buffer.
2.6 Ringing Switch Zero-Cross Current Turn Off
After the application of a logic input to turn SW4 off,
the ringing switch is designed to delay the change in
state until the next zero-crossing. Once on, the switch
requires a zero-current cross to turn off, and therefore
should not be used to switch a pure DC signal. The
switch will remain in the on state no matter the logic
input until the next zero crossing. These switching
characteristics will reduce and possibly eliminate
overall system impulse noise normally associated with
ringing switches. See IXYS IC Division’s application
note AN-144, Impulse Noise Benefits of Line Card Access
Switches for more information. The attributes of ringing
switch SW4 may make it possible to eliminate the
need for a zero-cross switching scheme. A minimum
impedance of 300 in series with the ringing
generator is recommended.
2.7 Power Supplies
Both a +5 V supply and battery voltage are connected
to the CPC7592. Switch state control is powered
exclusively by the +5 V supply. As a result, the
CPC7592 exhibits extremely low power consumption
during active and idle states.
Although battery power is not used for switch control, it
is required to supply trigger current for the integrated
internal protection circuitry SCR during fault
conditions. This integrated SCR is designed to
activate whenever the voltage at T
BAT
or R
BAT
drops 2
to 4 V below the applied voltage on the V
BAT
pin.
Because the battery supply at this pin is required to
source trigger current during negative overvoltage
fault conditions at tip and ring, it is important that the
net supplying this current be a low impedance path for
high speed transients such as lightning. This will
permit trigger currents to flow enabling the SCR to
activate and thereby prevent a fault induced negative
overvoltage event at the T
BAT
or R
BAT
nodes.
2.8 Battery Voltage Monitor
The CPC7592 also uses the V
BAT
voltage to monitor
battery voltage. If system battery voltage is lost, the
CPC7592 immediately enters the all-off state. It
remains in this state until the battery voltage is
restored. The device also enters the all-off state if the
battery voltage rises more positive than about –10 V
with respect to ground and remains in the all-off state
until the battery voltage drops below approximately
–15 V with respect to ground. This battery monitor
feature draws a small current from the battery (less
than 1 A typical) and will add slightly to the device’s
overall power dissipation.
This monitor function performs properly if the
CPC7592 and SLIC share a common battery supply
origin. Otherwise, if battery is lost to the CPC7592 but
not to the SLIC, then the V
BAT
pin will be internally
biased by the potential applied at the T
BAT
or R
BAT
pins via the internal protection circuitry SCR trigger
current path.
2.9 Protection
2.9.1 Diode Bridge/SCR
The CPC7592 uses a combination of current limited
break switches, a diode bridge/SCR clamping circuit,
and a thermal shutdown mechanism to protect the
SLIC device or other associated circuitry from damage
during line transient events such as lightning. During a
positive transient condition, the fault current is
conducted through the diode bridge to ground via
F
GND
. Voltage is clamped to a diode drop above
ground. During a negative transient of 2 to 4 V more
negative than the voltage source at V
BAT
, the SCR
conducts and faults are shunted to F
GND
via the SCR
or the diode bridge.
In order for the SCR to crowbar (or foldback), the
SCR’s on-voltage (see “Protection Circuitry Electrical
Specifications” on page 9) must be less than the applied
voltage at the V
BAT
pin. If the V
BAT
voltage is less
negative than the SCR on-voltage or if the V
BAT
supply
is unable to source the trigger current, the SCR will not
crowbar.
For power induction or power-cross fault conditions,
the positive cycle of the transient is clamped to a diode
drop above ground and the fault current directed to
ground. The negative cycle of the transient will cause
the SCR to conduct when the voltage exceeds the
V
BAT
reference voltage by two to four volts, steering
the fault current to ground.
Note: The CPC7592xB does not contain the
protection SCR but instead uses diodes to clamp both
polarities of a transient fault. These diodes direct the
negative potential’s fault current to the V
BAT
pin.
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2.9.2 Current Limiting function
If a lightning strike transient occurs when the device is
in the talk state, the current is passed along the line to
the integrated protection circuitry and restricted by the
dynamic current limit response of the active switches.
During the talk state, when a 1000V 10x1000 s
lightning pulse (GR-1089-CORE) is applied to the line
though a properly clamped external protector, the
current seen at T
LINE
and R
LINE
will be a pulse with a
typical magnitude of 2.5 A and a duration less than
0.5 s.
If a power-cross fault occurs with the device in the talk
state, the current is passed though break switches
SW1 and SW2 on to the integrated protection circuit
but is limited by the dynamic DC current limit response
of the two break switches. The DC current limit
specified over temperature is between 80 mA and
425 mA and the circuitry has a negative temperature
coefficient. As a result, if the device is subjected to
extended heating due to a power cross fault condition,
the measured current at T
LINE
and R
LINE
will decrease
as the device temperature increases. If the device
temperature rises sufficiently, the temperature
shutdown mechanism will activate and the device will
enter the all-off state.
2.10 Thermal Shutdown
The thermal shutdown mechanism activates when the
device die temperature reaches a minimum of 110 C,
placing the device in the all-off state regardless of
logic input. During thermal shutdown events the T
SD
pin will output a logic low with a nominal 0 V level. A
logic high is output from the T
SD
pin during normal
operation with a typical output level equal to V
DD
.
If presented with a short duration transient such as a
lightning event, the thermal shutdown feature will
typically not activate. But in an extended power-cross
event, the device temperature will rise and the thermal
shutdown mechanism will activate forcing the switches
to the all-off state. At this point the current measured
into T
LINE
or R
LINE
will drop to zero. Once the device
enters thermal shutdown it will remain in the all-off
state until the temperature of the device drops below
the de-activation level of the thermal shutdown circuit.
This permits the device to autonomously return to
normal operation. If the transient has not passed,
current will again flow up to the value allowed by the
dynamic DC current limiting of the switches and
heating will resume, reactivating the thermal shutdown
mechanism. This cycle of entering and exiting the
thermal shutdown mode will continue as long as the
fault condition persists. If the magnitude of the fault
condition is great enough, the external secondary
protector will activate shunting the fault current to
ground.
2.11 External Protection Elements
The CPC7592 requires only over voltage secondary
protection on the loop side of the device. The
integrated protection feature described above negates
the need for additional external protection on the SLIC
side. The secondary protector must limit voltage
transients to levels that do not exceed the breakdown
voltage or input-output isolation barrier of the
CPC7592. A foldback or crowbar type protector is
recommended to minimize stresses on the CPC7592.
Consult IXYS IC Division’s application note, AN-100,
Designing Surge and Power Fault Protection Circuits for
Solid State Subscriber Line Interfaces” for equations
related to the specifications of external secondary
protectors, fused resistors and PTCs.
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3 Manufacturing Information
3.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
3.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
3.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
3.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Device Moisture Sensitivity Level (MSL) Rating
CPC7592BA / CPC7592BB / CPC7592BC MSL 1
Device Maximum Temperature x Time
CPC7592BA / CPC7592BB / CPC7592BC 260°C for 30 seconds
e
3
Pb

CPC7592BC

Mfr. #:
Manufacturer:
IXYS Integrated Circuits
Description:
Switch ICs - Various 6-pole SOIC LCAS extra logic
Lifecycle:
New from this manufacturer.
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