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VND810MSP13TR
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
Package and PCB the
rmal data
VND810MSP
22/27
T
able 14.
T
hermal parameters
Area / isla
nd (cm
2
)
Footprint
6
R1 (°C/W)
0.35
R2 (°C/W)
1.8
R3 (°C/W)
1.1
R4 (°C/W)
0.8
R5 (°C/W)
12
R6 (°C/W)
37
22
C1 (W
.s/°C)
0.0001
C2 (W
.s/°C)
7E-04
C3 (W
.s/°C)
0.008
C4 (W
.s/°C)
0.3
C5 (W
.s/°C)
0.75
C6 (W
.s/°C)
3
5
Obsolete Product(s) - Obsolete Product(s)
VND810MSP
Package and packing informat
ion
23/27
5
P
acka
g
e and packing inf
ormation
5.1 ECOP
A
CK
®
pac
kages
In order to meet en
vironmental requirements
, ST off
ers these de
vices in diff
erent grades of
ECOP
ACK
®
pac
kages
, depending on their
le
v
el of
en
vironmental complian
ce. ECOP
A
C
K
®
specifications
, gr
ade definitions and
product stat
us are a
v
ailable at: www
.st.com.
ECOP
ACK
®
is an ST trademark.
5.2 P
owerSO-10
mechanical
data
Figure 31.
P
owerSO-10 pac
kage dimensions
DE
T
AI
L "
A
"
PL
AN
E
SEA
T
I
N
G
α
L
A1
F
A1
h
A
D
D1
=
=
= =
E4
0.
10
A
E
C
A
B
B
DE
T
AI
L "
A
"
SEA
T
I
N
G
PL
A
N
E
E2
10
1
eB
HE
0.2
5
Obsolete Product(s) - Obsolete Product(s)
Package and packin
g information
VND810MSP
24/27
T
able 15.
Po
werSO-10 mechani
cal data
Dim.
mm
Min.
T
yp.
Max.
A
3.35
3.65
A
(1)
1.
Muar only POA P013P.
3.4
3.6
A1
0
0.10
B
0.40
0.60
B
(1)
0.37
0.53
C
0.35
0.55
C
(1)
0.23
0.32
D
9.40
9.60
D1
7.40
7.60
E
9.30
9.50
E2
7.20
7.60
E2
(1)
7.30
7.50
E4
5.90
6.10
E4
(1)
5.90
6.30
e1
.
2
7
F
1.25
1.35
F
(1)
1.20
1.40
H
13.80
14.40
H
(1)
13.85
14.35
h0
.
5
0
L
1.20
1.80
L
(1)
0.80
1.10
α
0°
8°
α
(1)
2°
8°
Obsolete Product(s) - Obsolete Product(s)
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
VND810MSP13TR
Mfr. #:
Buy VND810MSP13TR
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Double Ch High Side
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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