Data Sheet
March 2008
1010 Lineage Power
18 Vdc to 36 Vdc Input, 15 Vdc Output; 50 W to 100 W
JC050C, JC075C, JC100C Power Modules: dc-dc Converters;
Feature Descriptions(continued)
Output Voltage Set-Point Adjustment
(Trim)
(continued)
8-715 (C).d
Figure 18. Circuit Configuration to Increase
Output Voltage
8-2056 (C)
Figure 19. Resistor Selection for Increased Output
Voltage
Output Overvoltage Clamp
The ouput overvoltage clamp consists of control cir-
cuitry, independent of the primary regulation loop, that
monitors the voltage on the output terminals. The con-
trol loop of the clamp has a higher voltage set point
than the primary loop (see Feature specifications
table). this provides a redundant voltage control that
reduces the risk of output overvoltage.
Overtermperature Protection (Shutdown)
The 100 W module features an overtemperature pro-
tection circuit to safeguard against thermal damage.
The circuit shuts down the module when the maximum
case temperature is exceeded. The module restarts
automatically after cooling.
Thermal Considerations
Introduction
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection,a nd radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. Peak temperature (Tc)
occurs at the position indicated in Figure 20.
8-716 (C).f
Note: Top view, pin locations are for reference.
Measurements shown in millimeters and (inches).
Figure 20. Case Temperature Measurement
Location
The temperature at this location should not exceed
100 °C. The output power of the module should not
exceed the rated power for the module as listed in the
Ordering Information table.
VI(+)
V
I(–)
ON/OFF
CASE
V
O(+)
V
O(–)
SENSE(+)
TRIM
SENSE(–)
Radj-up
RLOAD
268
ADJUSTMENT RESISTOR VALUE (Ω)
10
04
% CHANGE IN OUTPUT VOLTAGE (Δ%)
100k
1M
10M
100M
38.0 (1.50)
MEASURE CASE
V
I(–)
ON/OFF
CASE
+ SEN
TRIM
– SEN
V
I(+)
V
O(–)
V
O(+)
7.6 (0.3)
TEMPERATURE HERE
Lineage Power 11
Data Sheet
March 2008 18 Vdc to 36 Vdc Input, 15 Vdc Output; 50 W to 100 W
JC050C, JC075C, JC100C Power Modules: dc-dc Converters;
Thermal Considerations (continued)
Introduction (continued)
Although the maximum case temperature of the power
modules is 100 °C, you can limit this temperature to a
lower value for extremely high reliability.
For additional information on these modules, refer to the
Thermal Management JC-, JFC-, JW-, and JFW-Series
50 W to 150 W Board-Mounted Power Modules Technical
Note (TN97-008EPS).
Heat Transfer Without Heat Sinks
Increasing airflow over the module enhances the heat
transfer via convection. Figure 21 shows the maximum
power that can be dissipated by the module without
exceeding the maximum case temperature versus local
ambient temperature (T
A) for natural convection
through 4 m/s (800 ft./min.).
Note that the natural convection condition was mea-
sured at 0.05 m/s to 0.1 m/s (10 ft./min. to 20 ft./min.);
however, systems in which these power modules may
be used typically generate natural convection airflow
rates of 0.3 m/s (60 ft./min.) due to other heat dissipat-
ing components in the system. The use of Figure 21 is
shown in the following example.
Example
What is the minimum airflow necessary for a JC100C
operating at nominal line, an output current of 6 A, and
a maximum ambient temperature of 40 °C?
Solution
Given: V
I = 28 V
I
O = 6 A
T
A = 40 °C
Determine P
D (Use Figure 23.):
P
D = 14.0 W
Determine airflow (v) (Use Figure 21.):
v = 1.5 m/s (300 ft./min.)
8-1150 (C).a
Figure 21. Forced Convection Power Derating with
No Heat Sink; Either Orientation
8-1583 (C)
Figure 22. JC050C Power Dissipation vs.
Output Current
0 10203040 10
0
0
35
LOCAL AMBIENT TEMPERATURE, T
A (˚C)
POWER DISSIPATION, PD (W)
25
20
10
90
80706050
4.0 m/s (800 ft./min.)
0.1 m/s (NAT. CONV.)
(20 ft./min.)
0.5 m/s (100 ft./min.)
1.0 m/s (200 ft./min.)
1.5 m/s (300 ft./min.)
2.0 m/s (400 ft./min.)
2.5 m/s (500 ft./min.)
3.0 m/s (600 ft./min.)
3.5 m/s (700 ft./min.)
5
15
30
0.5 1.0 1.5 2.52.0 3.0
0
6
OUTPUT CURRENT, I
O (A)
4
3
5
8
3.5
0.0
7
2
1
9
10
POWER DISSIPATION, PD (W)
VI = 18 V
V
I = 28 V
V
I = 36 V
Data Sheet
March 2008
1212 Lineage Power
18 Vdc to 36 Vdc Input, 15 Vdc Output; 50 W to 100 W
JC050C, JC075C, JC100C Power Modules: dc-dc Converters;
Thermal considerations (continued)
Heat Transfer Without Heat Sinks (continued)
8-1584 (C)
Figure 23. JC100C Power Dissipation vs.
Output Current
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N-m (5 in.-lb.). For a screw attachment
from the pin side, the recommended hole size on the
customer’s PWB around the mounting holes is
0.130 ± 0.005 inches. If a larger hole is used, the
mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lbs.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (ΔT
C, max) divided by the
module power dissipation (P
D):
The location to measure case temperature (T
C) is
shown in Figure 20. Case-to-ambient thermal resis-
tance vs. airflow is shown, for various heat sink config-
urations and heights, in Figure 24. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
8-1153
Figure 24. Case-to-Ambient Thermal Resistance
Curves; Either Orientation
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 24 had a
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 24 is shown in the following example
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the JC100C
module is operating at nominal line and an output cur-
rent of 6 A, maximum ambient air temperature of
40 °C, and the heat sink is 0.5 in.
14
6
1 2 3 54 6
0
12
OUTPUT CURRENT, IO (A)
8
10
4
2
16
70
POWER DISSIPATION, PD (W)
18
VI = 18 V
VI = 28 V
VI = 36 V
θca
ΔTCmax,
PD
---------------------
T
C TA()
P
D
------------------------
==
00.5
(100)
1.0
(200)
1.5
(300)
2.0
(400)
2.5
(500)
3.0
(600)
0
1
5
6
7
8
AIR VELOCITY MEASURED IN m/s (ft./min.)
4
3
2
CASE-TO-AMBIENT THERMAL
RESISTANCE, RCA (°C/W)
1 1/2 IN HEAT SINK
1 IN HEAT SINK
1/2 IN HEAT SINK
1/4 IN HEAT SINK
NO HEAT SINK

JC100C1

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Description:
DC DC CONVERTER 15V 100W
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