NLAS7213
www.onsemi.com
9
PACKAGE DIMENSIONS
UQFN8, 1.5x1.5, 0.5P
CASE 523AH
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
8X
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
3
5
8
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.50 BSC
L1 0.00 0.03
E 1.50 BSC
e 0.50 BSC
L 0.30 0.40
L1
DETAIL A
A1
A3
DETAIL B
OPTIONAL
MOLD CMPD
EXPOSED Cu
L
CONSTRUCTION
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
0.45
7X
DIMENSIONS: MILLIMETERS
1
L4 0.10 REF
7
L
L4
0.30
8X
0.55
1.80
1.80
0.50
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NLAS7213/D
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