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AT45DB041A-RC

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
AT45DB041A
25
Figure 2. Algorithm for Randomly Modifying Data
Notes: 1. To preserve data integrity, each page of a DataFlash sector must be updated/rewritten at least once within every 10,000
cumulative page erase/program operations.
2. A Page Address Pointer must be maintained to indicate which page is to be rewritten. The Auto Page Rewrite command
must use the address specified by the Page Address Pointer.
3. Other algorithms can be used to rewrite portions of the Flash array. Low-power applications may choose to wait until 10,000
cumulative page erase/program operations have accumulated before rewriting all pages of the sector. See application note
AN-4 (“Using Atmel’s Serial DataFlash”) for more details.
Sector Addressing
PA10 PA9 PA8 PA7 PA6 PA5 PA4 PA3 PA2-PA0 Sector
0 0000000 X 0
0 0 0XXXXX X 1
0 0 1XXXXX X 2
0 1XXXXXX X 3
1 0XXXXXX X 4
1 1XXXXXX X 5
START
MAIN MEMORY PAGE
TO BUFFER TRANSFER
(53H, 55H)
INCREMENT PAGE
ADDRESS POINTER
(2)
AUTO PAGE REWRITE
(2)
(58H, 59H)
END
provide address of
page to modify
If planning to modify multiple
bytes currently stored within
a page of the Flash array
MAIN MEMORY PAGE PROGRAM
THROUGH BUFFER
(82H, 85H)
BUFFER WRITE
(84H, 87H)
BUFFER TO MAIN
MEMORY PAGE PROGRAM
(83H, 86H)
AT45DB041A
26
Ordering Information
f
SCK
(MHz)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
13 10 0.01 AT45DB041A-JC
AT45DB041A-RC
AT45DB041A-TC
AT45DB041A-CC
32J
28R
28T
14C1
Commercial
(0°C to 70°C)
2.7V to 3.6V
13 10 0.01 AT45DB041A-JI
AT45DB041A-RI
AT45DB041A-TI
AT45DB041A-CI
32J
28R
28T
14C1
Industrial
(-40°C to 85°C)
2.7V to 3.6V
10 10 0.01 AT45DB041A-RC-2.5
AT45DB041A-TC-2.5
28R
28T
Commercial
(0°C to 70°C)
2.5V to 3.0V
Package Type
32J 32-lead, Plastic J-leaded Chip Carrier Package (PLCC)
28R 28-lead, 0.330" Wide, Plastic Gull Wing Small Outline Package (SOIC)
28T 28-lead, Plastic Thin Small Outline Package (TSOP)
14C1 14-ball, 3 x 5 Array Plastic Chip-scale Ball Grid Array (CBGA)
AT45DB041A
27
Packaging Information
.045(1.14) X 45˚
PIN NO. 1
IDENTIFY
.025(.635) X 30˚ - 45˚
.012(.305)
.008(.203)
.021(.533)
.013(.330)
.530(13.5)
.490(12.4)
.030(.762)
.015(.381)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.032(.813)
.026(.660)
.050(1.27) TYP
.553(14.0)
.547(13.9)
.595(15.1)
.585(14.9)
.300(7.62) REF
.430(10.9)
.390(9.90)
AT CONTACT
POINTS
.022(.559) X 45˚ MAX (3X)
.453(11.5)
.447(11.4)
.495(12.6)
.485(12.3)
*Controlling dimension: millimeters
INDEX
MARK
AREA
0.55 (0.022)
BSC
0.20 (0.008)
0.10 (0.004)
7.15 (0.281)
REF
8.10 (0.319)
7.90 (0.311)
1.25 (0.049)
1.05 (0.041)
0.27 (0.011)
0.18 (0.007)
11.9 (0.469)
11.7 (0.461)
13.7 (0.539)
13.1 (0.516)
0
5
0.20 (0.008)
0.15 (0.006)
REF
0.70 (0.028)
0.30 (0.012)
A
B
C
D
E
321
4.0 (0.157)
1.37 (0.054)
1.13 (0.044)
0.46 (0.018)
DIA BALL TYP
1.62 (0.064)
1.38 (0.054)
2.0 (0.079)
7.2 (0.283)
6.8 (0.268)
1.40 (0.055) MAX
0.30 (0.012)
4.7 (0.185)
4.3 (0.169 )
1.00 (0.039) BSC
NON-ACCUMULATIVE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
28R, 28-lead, 0.330" Wide, Plastic Gull Wing Small
Outline (SOIC)
Dimensions in Inches and (Millimeters)
28T, 28-lead, Plastic Thin Small Outline
Package (TSOP)
Dimensions in Millimeters and (Inches)*
14C1, 14-ball (3 x 5 Array), 1.0 mm Pitch,
4.5 x 7.0 mm Plastic Chip-scale Ball Grid
Array (CBGA)
Dimensions in Millimeters and (Inches)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

AT45DB041A-RC

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Description:
IC FLASH 4M SPI 13MHZ 28SOIC
Lifecycle:
New from this manufacturer.
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