MM3Z2V4ST1 SERIES
http://onsemi.com
4
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE D
1.60
0.063
0.63
0.025
mm
inches
SCALE 10:1
0.83
0.033
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F
DRAWING WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 1.60 1.80 0.063 0.071
B 1.15 1.35 0.045 0.053
C 0.80 1.00 0.031 0.039
D 0.25 0.40 0.010 0.016
E 0.15 REF 0.006 REF
H 0.00 0.10 0.000 0.004
J 0.089 0.177 0.0035 0.0070
K 2.30 2.70 0.091 0.106
NOTE 3
A
K
1
2
D
B
E
H
C
J
STYLE 1:
PIN 1. CATHODE
2. ANODE
L 0.075 −−− 0.003 −−−
NOTE 5
L
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MM3Z2V4ST1/D
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