MUN2236, MMUN2236L, MUN5236, DTC115EE, DTC115EM3
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Table 2. THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
THERMAL CHARACTERISTICS (SC−59) (MUN2236)
Total Device Dissipation
T
A
= 25°C (Note 1)
(Note 2)
Derate above 25°C (Note 1)
(Note 2)
P
D
230
338
1.8
2.7
mW
mW/°C
Thermal Resistance, (Note 1)
Junction to Ambient (Note 2)
R
q
JA
540
370
°C/W
Thermal Resistance, (Note 1)
Junction to Lead (Note 2)
R
q
JL
264
287
°C/W
Junction and Storage Temperature Range T
J
, T
stg
−55 to +150 °C
THERMAL CHARACTERISTICS (SOT−23) (MMUN2236L)
Total Device Dissipation
T
A
= 25°C (Note 1)
(Note 2)
Derate above 25°C (Note 1)
(Note 2)
P
D
246
400
2.0
3.2
mW
mW/°C
Thermal Resistance, (Note 1)
Junction to Ambient (Note 2)
R
q
JA
508
311
°C/W
Thermal Resistance, (Note 1)
Junction to Lead (Note 2)
R
q
JL
174
208
°C/W
Junction and Storage Temperature Range T
J
, T
stg
−55 to +150 °C
THERMAL CHARACTERISTICS (SC−70/SOT−323) (MUN5236)
Total Device Dissipation
T
A
= 25°C (Note 1)
(Note 2)
Derate above 25°C (Note 1)
(Note 2)
P
D
202
310
1.6
2.5
mW
mW/°C
Thermal Resistance, (Note 1)
Junction to Ambient (Note 2)
R
q
JA
618
403
°C/W
Thermal Resistance, (Note 1)
Junction to Lead (Note 2)
R
q
JL
280
332
°C/W
Junction and Storage Temperature Range T
J
, T
stg
−55 to +150 °C
THERMAL CHARACTERISTICS (SC−75) (DTC115EE)
Total Device Dissipation
T
A
= 25°C (Note 1)
(Note 2)
Derate above 25°C (Note 1)
(Note 2)
P
D
200
300
1.6
2.4
mW
mW/°C
Thermal Resistance, (Note 1)
Junction to Ambient (Note 2)
R
q
JA
600
400
°C/W
Junction and Storage Temperature Range T
J
, T
stg
−55 to +150 °C
THERMAL CHARACTERISTICS (SOT−723) (DTC115EM3)
Total Device Dissipation
T
A
= 25°C (Note 1)
(Note 2)
Derate above 25°C (Note 1)
(Note 2)
P
D
260
600
2.0
4.8
mW
mW/°C
Thermal Resistance, (Note 1)
Junction to Ambient (Note 2)
R
q
JA
480
205
°C/W
Junction and Storage Temperature Range T
J
, T
stg
−55 to +150 °C
1. FR−4 @ Minimum Pad.
2. FR−4 @ 1.0 x 1.0 Inch Pad.