HMC862A Data Sheet
Rev. 0 | Page 6 of 15
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
12
11
10
1
3
4
9
2
6
5
7
8
16
15
14
13
GND
IN
IN
GND
GND
V
CC
GN
GN
V
CC
OUT
OUT
PACKAGE
BASE
GND
GND
S0
S1
S2
GND
HMC862A
TOP VIEW
(Not to Scale)
NOTES
1. EXPOSED PAD. EXPOSED PAD MUST
BE CONNECTED TO RF/DC GROUND.
13599-002
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 4, 8, 9,
12, 14, 15
GND Ground. The backside of the package has an exposed metal ground slug that must be connected to RF/dc ground.
2 IN RF Input. This pin must be dc blocked.
3
IN
RF Input, 180° Out of Phase with Pin 2 for Differential Operation. This pin must be ac grounded for single-ended
operation. DC block this pin for differential operation.
5, 6, 7 S0, S1, S2 CMOS Compatible Division Ratio Control Bits. See Table 5.
10
OUT
Divider Output, 180° Out of Phase with Pin 11. This RF output must be dc blocked. See Figure 31 for proper termination.
11 OUT Divided Output. This RF output must be dc blocked. See Figure 31 for proper termination.
13, 16 V
CC
Supply Voltage Pins, 5 V. Connect both V
CC
pins to a 5 V supply. These pins are internally connected.
EPAD Exposed Pad. Exposed pad must be connected to RF/dc ground.