NCP1086
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12
PACKAGE DIMENSIONS
D
PAK−3
CASE 418AB−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH AND GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.005 MAXIMUM PER SIDE. THESE DIMENSIONS
TO BE MEASURED AT DATUM H.
4. THERMAL PAD CONTOUR OPTIONAL WITHIN
DIMENSIONS E, L1, D1, AND E1. DIMENSIONS
D1 AND E1 ESTABLISH A MINIMUM MOUNTING
SURFACE FOR THE THERMAL PAD.
E
D
L1
c2
c
b
e
H
A1
E1
D1
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
E 0.380 0.420 9.65 10.67
D 0.325 0.368 8.25 9.53
A 0.170 0.180 4.32 4.57
b 0.026 0.036 0.66 0.91
c2 0.045 0.055 1.14 1.40
e 0.100 BSC 2.54 BSC
H 0.580 0.620 14.73 15.75
L1 −−− 0.066 −−− 1.68
A1 0.000 0.010 0.00 0.25
c 0.017 0.026 0.43 0.66
L 0.090 0.110 2.29 2.79
M 0 8
E1
D1
L3 0.010 BSC 0.25 BSC
°°0 8 °°
A
0.245 −−− 6.22 −−−
0.270 −−− 6.86 −−−
A
VIEW A−A
L3
B
H
L
M
DETAIL C
SEATING
PLANE
GAUGE
PLANE
B
SEATING
PLANE
A
A
3X
M
A
M
0.13 B
E/2
DETAIL C
M
A
M
0.10 B
MOUNTING FOOTPRINT*
RECOMMENDED
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DIMENSIONS: MILLIMETERS
0.424
3X
0.631
0.310
0.180
0.040
0.100
PITCH
PACKAGE THERMAL DATA
Parameter
TO−220−3 D
2
PAK−3 SOT−223 Unit
R
q
JC
Typical 3.5 3.5 15 °C/W
R
q
JA
Typical 50 10−50* 156 °C/W
* Depending on thermal properties of substrate. R
q
JA
= R
q
JC
+ R
q
CA
