5
SMT Soldering Prole
Pb free reow soldering Prole
245°C
TIME
TEMPERATURE
6°C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
3°C/SEC. MAX.
3°C/SEC. MAX.
10 - 30 SEC.
150°C
200°C
217°C
(Acc. to J-STD-020C)
Recommended Soldering Pattern (unit: mm)
Intensity Bin Limit (mcd)
Blue
Iv Bin Category Min Max
M 5.40 8.60
N 8.60 13.70
P 13.70 21.80
Tolerance +/-15%
Note:
1. Bin categories are established for classication of products. Products
may not be available in all categories. Please contact your Avago
representative for information on currently available bins.
2.6
1.9 x 4 = 7.6
12.8
1.4
Recommended stencil window opening is 80%
Notes:
1. The peak temperature refers to the peak package body temperature.
2. Number of reow process shall be limited to maximum 2 times only.
Cooling process to normal temperature is required between rst and
second soldering process.