IR2112
(
-1-2
)(
S
)
PbF
2 www.irf.com
Note 1: Logic operational for V
S
of -5 to +600V. Logic state held for V
S
of -5V to -V
BS
. (Please refer to the Design Tip
DT97-3 for more details).
Note 2: When VDD < 5V, the minimum VSS offset is limited to -VDD.
Symbol Definition Min. Max. Units
V
B
High Side Floating Supply Absolute Voltage V
S
+ 10 V
S
+ 20
V
S
High Side Floating Supply Offset Voltage Note 1 600
V
HO
High Side Floating Output Voltage V
S
V
B
V
CC
Low Side Fixed Supply Voltage 10 20
V
LO
Low Side Output Voltage 0 VCC
V
DD
Logic Supply Voltage V
SS
+ 3 V
SS
+ 20
V
SS
Logic Supply Offset Voltage -5 (Note 2) 5
V
IN
Logic Input Voltage (HIN, LIN & SD) V
SS
V
DD
T
A
Ambient Temperature -40 125 °C
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. The V
S
and V
SS
offset ratings are tested with all supplies biased at 15V differential. Typical
ratings at other bias conditions are shown in Figures 36 and 37.
V
Symbol Definition Min. Max. Units
V
B
High Side Floating Supply Voltage -0.3 625
V
S
High Side Floating Supply Offset Voltage V
B
- 25 V
B
+ 0.3
V
HO
High Side Floating Output Voltage V
S
- 0.3 V
B
+ 0.3
V
CC
Low Side Fixed Supply Voltage -0.3 25
V
LO
Low Side Output Voltage -0.3 V
CC
+ 0.3
V
DD
Logic Supply Voltage -0.3 V
SS
+ 25
V
SS
Logic Supply Offset Voltage V
CC
- 25 V
CC
+ 0.3
V
IN
Logic Input Voltage (HIN, LIN & SD) V
SS
- 0.3 V
DD
+ 0.3
dV
s
/dt Allowable Offset Supply Voltage Transient (Figure 2) — 50 V/ns
P
D
Package Power Dissipation @ T
A
≤ +25°C (14 Lead DIP) — 1.6
(16 Lead SOIC) — 1.25
R
THJA
Thermal Resistance, Junction to Ambient (14 Lead DIP) — 75
(16 Lead SOIC) — 100
T
J
Junction Temperature — 150
T
S
Storage Temperature -55 150
T
L
Lead Temperature (Soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured
under board mounted and still air conditions. Additional information is shown in Figures 28 through 35.
°C/W
W
V
°C
