AT97SC3205T [SUMMARY DATASHEET]
Atmel-8883AS-TPM-AT97SC3205T-Datasheet-Summary_022014
7
4. Package Drawings
4.1 28X1 — 28-lead Thin TSSOP
TITLE
28X1, 28-lead, 4.4mm Body Width, Plastic Thin
Shrink Small Outline Package (TSSOP)
GPC
TFL
DRAWING NO.
28X1
REV.
A
e
D
E
E1
15
14
28
1
C
END VIEW
SEE DETAIL "A"
C
L
DETAIL 'A'
0.25
L
(12° REF)
(12° REF)
(1.00 REF)
R1
R
S
TOP VIEW
(0°~8°)
2X N/2 TIPS
0.20 C B A
B
H
D
A
A1
A2
SIDE VIEW
SEATING
PLANE
C
0.10 C
0.10
CBA
28X b
A
SYMBOL MIN NOM MAX NOTE
A
A1
b
D
E
E1
e
L
COMMON DIMENSIONS
(UNIT OF MEASURE=MM)
-
0.05
0.19
-
-
6.40BSC
1.10
0.15
0.30
1
A2 0.85 0.90 0.95
-
c
0.09 0.20
-
9.60 9.80
9.70
4.30 4.40 4.50
0.45 0.60
0.75
0.65 BSC
1
2
R1
S
R
0.09
-
-
0.09
-
-
0.20
-
-
Note:
2. Dimension D does not include mold flash, protrusions or gate burrs. Mold
flash,protrusions or gate burrs shall not exceed 0.15mm per end. Dimension E1
does not include interlead flash or protrusion. Interlead flash or protrusion
shall not exceed 0.25mm per side.
3. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08mm total in excess of the "b" dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
1. Refer to JEDEC drawing MO-153,variation AE
7/8/2011
Package Drawing Contact:
packagedrawings@atmel.com
