Product Brief
Published by
Infineon Technologies AG
85579 Neubiberg, Germany
© 2013 Infineon Technologies AG.
All Rights Reserved.
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Order Number: B132-H9781-G1-X-7600
Date: 08 / 2013
Attention please!
The information given in this document shall in no event
be regarded as a guarantee of conditions or characteristics
(“Beschaenheitsgarantie”). With respect to any examples
or hints given herein, any typical values stated herein and/
or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warran-
ties and liabilities of any kind, including without limitation
warranties of non-infringement of intellectual property
rights of any third party.
Information
For further information on technology, delivery terms and
conditions and prices please contact your nearest Infineon
Technologies Oce (www.infineon.com).
Warnings
Due to technical requirements components may contain
dangerous substances. For information on the types in
question please contact your nearest Infineon Technolo-
gies Oce. Infineon Technologies Components may only
be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause
the failure of that life-support device or system, or to aect
the safety or eectiveness of that device or system. Life
support devices or systems are intended to be implanted
in the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is reason-
able to assume that the health of the user or other persons
may be endangered.
Benefits of BGT60
Packaged solution, easy to use and standard SMT flow for mounting
on customer system
Highly integrated RF transceiver requiring no external
RF discretes, thereby simplifying the customer design and
time-to-market
Architecture of Direct Conversion Zero IF eases interface to
latest modem/BB designs (no external filter)
A transceiver approach with implemented BIST (Built-In Self-Test)
on the chip to enable RF testing at Infineon production
Family concept (common architecture, package, pinning)
simplifies customer designs due to modular approach
Transceiver Chip Solution
BGT60 for ISM band (license free), 57–64GHz
BGT60 has identical pinning and same footprint as
BGT70 or BGT80
Channel, Tx or Rx, selection via SPI
V-Band TDD
Base Station A Base Station B
I/F I/Q Downconversion
I/F I/Q Upconversion
I/F I/Q Downconversion
I/F I/Q Upconversion
BGT60
Tx or Rx
On
BGT60
Rx or Tx
On
Half Duplex System in TDD
Infineon rounds o the Backhaul Family with
a packaged RF Solution for V-band Radio
Backhaul Transceiver Chip – BGT60
However, if we compare the 60GHz V-band with the 80GHz E-band, the
former is always seen as a less favorable frequency band, due to the
sharp oxygen absorption. This means that in addition to the Free Space
Loss (FSL), oxygen absorption loss must be taken into account and a
margin allowed for rain fade. As a result, a maximum link distance of up
to 1000 meters is possible.
This could be considered a disadvantage in traditional network design,
where a microwave link would mostly be used for distances beyond
1000 meters. Particularly in the case of Picocell deployment, high
oxygen absorption and the associated reduced range becomes a real
benefit compared to traditional microwave or other wireless backhaul-
ing solutions:
Benefits of V-band Radio
Hundreds of links can be installed in a dense area
Very low interference between the PTP links or other 60GHz devices
in the field
High bandwidth for up to 1Gbit/s (full duplex) per link
The Infineon business approach enables such a Gbit service with the
latest technology. Thanks to Infineon’s advanced SiGe (Silicon Germa-
nium) technology with a transit frequency of 200GHz, we can integrate
all RF (Radio Frequency) building blocks – such as Power Amplifier (PA),
Low Noise Amplifier (LNA), Mixer, Programmable Gain Amplifier (PGA),
Voltage Controlled Oscillator (VCO) – into a single chip.
This technology is already proven and fully qualified for Infineon
Millimeter and Microwave chipsets (e.g. 77GHz automotive radar).
Furthermore, Infineon houses this single-chip in a plastic package
which makes a major dierence to the market. Up to now, solutions
have been bare die and require expensive tools and equipment to build
up a radio system. With the Infineon packaged chipset, customers can
save money and reduce the time-to-market significantly.
The chip is a transceiver for 57–64GHz (BGT60), housed in an
eWLB(6 × 6mm²) package.
