IRF7704GTRPBF

Parameter Max. Units
V
DS
Drain- Source Voltage -40 V
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@ -10V -4.6
I
D
@ T
A
= 70°C Continuous Drain Current, V
GS
@ -10V -3.7 A
I
DM
Pulsed Drain Current -19
P
D
@T
A
= 25°C Power Dissipation 1.5
P
D
@T
A
= 70°C Power Dissipation 1.0
Linear Derating Factor 12 mW/°C
V
GS
Gate-to-Source Voltage ± 20 V
T
J,
T
STG
Junction and Storage Temperature Range -55 to + 150 °C
04/23/08
www.irf.com 1
IRF7704GPbF
HEXFET
®
Power MOSFET
Parameter Max. Units
R
θJA
Maximum Junction-to-Ambient 83 °C/W
Thermal Resistance
Absolute Maximum Ratings
W
V
DSS
R
DS(on)
max (mW) I
D
-40V 46@V
GS
= -10V -4.6A
74@V
GS
= -4.5V -3.7A
Description
l Ultra Low On-Resistance
l P-Channel MOSFET
l Very Small SOIC Package
l Low Profile (< 1.1mm)
l Available in Tape & Reel
l Lead-Free
l Halogen-Free
HEXFET
®
Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for,
provides thedesigner
with an extremely efficient and reliable device for
battery and load management.
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.2mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
TSSOP-8
PD-96149
IRF7704GPbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage -40 ––– ––– V V
GS
= 0V, I
D
= -250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.03 –– V/°C Reference to 25°C, I
D
= -1mA
––– ––– 46 V
GS
= -10V, I
D
= -4.6A
––– ––– 74 V
GS
= -4.5V, I
D
= -3.7A
V
GS(th)
Gate Threshold Voltage -1.0 ––– -3.0 V V
DS
= V
GS
, I
D
= -250µA
g
fs
Forward Transconductance 7.2 ––– ––– S V
DS
= -10V, I
D
= -4.6A
––– ––– -10 V
DS
= -32V, V
GS
= 0V
––– ––– -25 V
DS
= -32V, V
GS
= 0V, T
J
= 70°C
Gate-to-Source Forward Leakage ––– ––– -100 V
GS
= -20V
Gate-to-Source Reverse Leakage ––– ––– 100 V
GS
= 20V
Q
g
Total Gate Charge –– 25 38 I
D
= -4.6A
Q
gs
Gate-to-Source Charge ––– 10 15 nC V
DS
= -15V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 9.5 14 V
GS
= -4.5V
t
d(on)
Turn-On Delay Time ––– 25 ––– V
DD
= -20V
t
r
Rise Time ––– 360 ––– I
D
= -1.0A
t
d(off)
Turn-Off Delay Time ––– 190 ––– R
G
= 6.0
t
f
Fall Time ––– 100 ––– V
GS
= -4.5V
C
iss
Input Capacitance ––– 3150 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 250 ––– pF V
DS
= -25V
C
rss
Reverse Transfer Capacitance ––– 200 ––– ƒ = 1.0kHz
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode) showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– -1.2 V T
J
= 25°C, I
S
= -1.5A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 29 44 ns T
J
= 25°C, I
F
= -1.5A
Q
rr
Reverse Recovery Charge ––– 41 62 nC di/dt = -100A/µs
Source-Drain Ratings and Characteristics
A
-19



-1.5

S
D
G
Repetitive rating; pulse width limited by
max. junction temperature.
Notes:
Pulse width 400µs; duty cycle 2%.
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
I
GSS
µA
m
R
DS(on)
Static Drain-to-Source On-Resistance
I
DSS
Drain-to-Source Leakage Current
nA
ns
Surface mounted on 1 in square Cu board
IRF7704GPbF
www.irf.com 3
Fig 3. Typical Transfer Characteristics
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
0.01
0.1
1
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
-15V
-10V
-4.5V
-3.7V
-3.5V
-3.3V
-3.0V
-2.7V
-V , Drain-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
DS
D
-2.70V
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 150 C
J
°
TOP
BOTTOM
VGS
-15V
-10V
-4.5V
-3.7V
-3.5V
-3.3V
-3.0V
-2.7V
-V , Drain-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
DS
D
-2.70V
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
-10V
4.6A
Fig 4. Normalized On-Resistance
Vs. Temperature
2.5 3.0 3.5 4.0 4.5 5.0
-V
GS
, Gate-to-Source Voltage (V)
0.0
0.1
1.0
10.0
100.0
-
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
Α
)
T
J
= 25°C
T
J
= 150°C
V
DS
= -25V
20µs PULSE WIDTH

IRF7704GTRPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET P-CH 40V 4.6A 8-TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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