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PCA24S08DP,118
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P25
PCA24S08_2
All informatio
n provided in this d
ocument is subje
ct to legal discla
imers.
© NXP B.V
. 2010. All rights rese
rved.
Product data sheet
Rev
.
02 — 1
1 May 2010
16 of 25
NXP Semiconductors
PCA24S08
1024
×
8-bit CMOS EEPROM with access protection
10. EEPROM
memory
T
able 9.
EEPROM memory specifications
Parameter
Specification
data retention at operating
temperature
10 years (minimum)
endurance per byte
100,000 cycles (minimum)
PCA24S08_2
All informatio
n provided in this d
ocument is subje
ct to legal discla
imers.
© NXP B.V
. 2010. All rights rese
rved.
Product data sheet
Rev
.
02 — 1
1 May 2010
17 of 25
NXP Semiconductors
PCA24S08
1024
×
8-bit CMOS EEPROM with access protection
1
1. Package
outline
Fig 13.
Package
outline SOT96-1 (SO8)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.05
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96
-1
99-12-27
03-02-18
PCA24S08_2
All informatio
n provided in this d
ocument is subje
ct to legal discla
imers.
© NXP B.V
. 2010. All rights rese
rved.
Product data sheet
Rev
.
02 — 1
1 May 2010
18 of 25
NXP Semiconductors
PCA24S08
1024
×
8-bit CMOS EEPROM with access protection
Fig 14.
Package ou
tline SOT505-1 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
L
H
E
L
p
wy
v
ce
D
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.70
0.35
6
°
0
°
0.1
0.1
0.1
0.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1
99-04-09
03-02-18
w
M
b
p
D
Z
e
0.25
14
8
5
θ
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v
M
A
X
A
y
2.5
5 mm
0
scale
T
SSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505
-1
1.1
pin 1 index
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P25
PCA24S08DP,118
Mfr. #:
Buy PCA24S08DP,118
Manufacturer:
NXP Semiconductors
Description:
IC EEPROM 8K I2C 400KHZ 8TSSOP
Lifecycle:
New from this manufacturer.
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