DS_S48SP3R310_10252013
10
THERMAL CONSIDERATIONS
Thermal management is an important part of the system
design. To ensure proper, reliable operation, sufficient
cooling of the power module is needed over the entire
temperature range of the module. Convection cooling is
usually the dominant mode of heat transfer.
Hence, the choice of equipment to characterize the
thermal performance of the power module is a wind
tunnel.
Thermal Testing Setup
Delta’s DC/DC power modules are characterized in
heated vertical wind tunnels that simulate the thermal
environments encountered in most electronics
equipment. This type of equipment commonly uses
vertically mounted circuit cards in cabinet racks in which
the power modules are mounted.
The following figure shows the wind tunnel
characterization setup. The power module is mounted
on a test PWB and is vertically positioned within the
wind tunnel. The space between the neighboring PWB
and the top of the power module is constantly kept at
6.35mm (0.25’’).
Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches)
12.7 (0.5”)
MODULE
A
IR FLOW
50.8
(
2.0
)
FACING PW B
PWB
A
IR VELOCIT
Y
A
ND AMBIEN
T
TEMPERATURE
MEASURED BELOW
THE MODULE
Figure 19: Wind tunnel test setup
Thermal Derating
Heat can be removed by increasing airflow over the
module. To enhance system reliability, the power module
should always be operated below the maximum operating
temperature. If the temperature exceeds the maximum
module temperature, reliability of the unit may be affected.
THERMAL CURVES
Figure 20: Hot spot temperature measured point
The allowed maximum hot spot temperature is defined at 110
0
1
2
3
4
5
6
7
8
9
10
11
60 65 70 75 80 85
Ambient Temperature ()
Output Current(A)
Natural
Convection
100LFM
S48SP3R310(Standard) Output Load vs. Ambient Temperature and Air Velocity
@Vin=48V (Either Orientation)
200LFM
300LFM
400LFM
500LFM
600LFM
Figure 21: Output load vs. ambient temperature and air
velocity@Vin=48V (Either Orientation)
DS_S48SP3R310_10252013
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PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL
RECOMMENDED PAD LAYOUT (SMD)
DS_S48SP3R310_10252013
12
LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE
Time ( sec. )
Pre-heat temp.
140~180
°
C 60~120 sec.
Peak temp.
210~230
°
C 5sec.
Ramp-up temp.
0.5~3.0
°
C /sec.
Temperature (°C )
50
100
150
250
300 60 0 120 180 240
2nd Ramp-up temp.
1.0~3.0
°
C /sec.
Over 200°C
40~50sec.
Cooling down rate <3
°
C /sec.
Note: The temperature refers to the pin of S48SP, measured on the pin +Vout joint.
LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE
Temp
.
Time
150
200
100~140 sec.
Time Limited 90 sec.
above 217
217
Preheat time
Ramp up
max. 3
/sec.
Ramp down
max. 4/sec.
Peak Tem
p
. 240 ~ 245
25
Note: The temperature refers to the pin of S48SP, measured on the pin +Vout joint.

S48SP3R310NMFB

Mfr. #:
Manufacturer:
Description:
Isolated DC/DC Converters 1X1", 3.3V, 10A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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