MAX317/MAX318/MAX319
Precision, CMOS Analog Switches
10 ______________________________________________________________________________________
______________________Chip Topography
7
6
4
5
8
9
32 1
0.058"
1.47mm
0.076"
1.93mm
__Ordering Information (continued)
* Contact factory for dice specifications.
** Contact factory for availability and processing to MIL-STD-883.
PART TEMP. RANGE PIN-PACKAGE
MAX318CPA 0°C to +70°C 8 Plastic DIP
MAX318CSA 0°C to +70°C 8 SO
MAX318CJA 0°C to +70°C 8 CERDIP
MAX318C/D 0°C to +70°C Dice*
MAX318EPA -40°C to +85°C 8 Plastic DIP
MAX318ESA -40°C to +85°C 8 SO
MAX318 EJA -40°C to +85°C 8 CERDIP
MAX318MJA -55°C to +125°C 8 CERDIP**
MAX319CPA 0°C to +70°C 8 Plastic DIP
MAX319CSA 0°C to +70°C 8 SO
MAX319CJA 0°C to +70°C 8 CERDIP
MAX319C/D 0°C to +70°C Dice*
MAX319EPA -40°C to +85°C 8 Plastic DIP
MAX319ESA -40°C to +85°C 8 SO
MAX319EJA -40°C to +85°C 8 CERDIP
MAX319MJA -55°C to +125°C 8 CERDIP**
DIE PAD MAX317 MAX318 MAX319
1 COM NC NC
2 GND GND GND
3 V+ V+ V+
4 VL VL VL
5 IN IN IN
6 V- V- V-
7 N.C. NO NO
8 N.C. COM COM
9 NC NC COM
TRANSISTOR COUNT: 32;
SUBSTRATE CONNECTED TO V+.