Atmel ATPL220A [summary datasheet]
43004A-ATPL-03/12
4. Recommended mounting conditions
4.1 Conditions of Standard Reflow
Table 4-1. Conditions of standard Reflow
Items Contents
Method IR(Infrared Reflow)/Convection
Times 2
Floor Life
Before unpacking
Please use within 2 years after
production
From unpacking to second reflow Within 8 days
In case over period of floor life
Baking with 125ºC +/- 3ºC for 24hrs
+2hrs/-0hrs is required. Then please
use within 8 days. (please remember
baking is up to 2 times)
Floor Life Condition
Between 5ºC and 30ºC and also below 70%RH required. (It is preferred lower
humidity in the required temp range.)
Figure 4-1. Temperature Profile
Note: H rank: 260ºC Max
a: Average ramp-up rate: 1ºC/s to 4ºC/s
b: Preheat & Soak: 170ºC to 190ºC, 60s to 180s
c: Average ramp-up rate: 1ºC/s to 4ºC
d: Peak temperature: 260ºC Max, up to 255ºC within 10s
d’: Liquidous temperature: Up to 230ºC within 40s or
Up to 225ºC within 60s or
Up to 220ºC within 80s
e: Cooling: Natural cooling or forced cooling
a
b c d
d’
e
260ºC
255ºC
Liquidous
Temperature
170-190ºC
RT
Temperature
Time
