VS-GB200TH120U

VS-GB200TH120U
www.vishay.com
Vishay Semiconductors
Revision: 12-Jun-15
1
Document Number: 94754
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molding Type Module IGBT,
2-in-1 Package, 1200 V and 200 A
FEATURES
10 μs short circuit capability
•V
CE(on)
with positive temperature coefficient
Maximum junction temperature 150 °C
Low switching losses
Rugged with ultrafast performance
Low inductance case
Fast and soft reverse recovery antiparallel FWD
Isolated copper baseplate using DCB (Direct Copper
Bonding) technology
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
Switching mode power supplies
Inductive heating
Electronic welder
DESCRIPTION
Vishay’s IGBT power module provides ultra low conduction
loss as well as short circuit ruggedness. It is designed for
applications such as electronic welder and inductive
heating.
Note
(1)
Repetitive rating: pulse width limited by maximum junction temperature.
PRODUCT SUMMARY
V
CES
1200 V
I
C
at T
C
= 80 °C 200 A
V
CE(on)
(typical)
at I
C
= 200 A, 25 °C
3.10 V
Speed 8 kHz to 30 kHz
Package Double INT-A-PAK
Circuit Half bridge
Double INT-A-PAK
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
CES
1200
V
Gate to emitter voltage V
GES
± 20
Collector current I
C
T
C
= 25 °C 330
A
T
C
= 80 °C 200
Pulsed collector current I
CM
(1)
t
p
= 1 ms 400
Diode continuous forward current I
F
T
C
= 80 °C 200
Diode maximum forward current I
FM
t
p
= 1 ms 400
Maximum power dissipation P
D
T
J
= 150 °C 1316 W
Short circuit withstand time t
SC
T
J
= 125 °C 10 μs
RMS isolation voltage V
ISOL
f = 50 Hz, t = 1 min 2500 V
VS-GB200TH120U
www.vishay.com
Vishay Semiconductors
Revision: 12-Jun-15
2
Document Number: 94754
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IGBT ELECTRICAL SPECIFICATIONS (T
C
= 25 °C unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
(BR)CES
T
J
= 25 °C 1200 - -
VCollector to emitter voltage V
CE(on)
V
GE
= 15 V, I
C
= 200 A, T
J
= 25 °C - 3.10 3.60
V
GE
= 15 V, I
C
= 200 A, T
J
= 125 °C - 3.45 -
Gate to emitter threshold voltage V
GE(th)
V
CE
= V
GE
, I
C
= 2.0 mA, T
J
= 25 °C 4.4 4.9 6.0
Collector cut-off current I
CES
V
CE
= V
CES
, V
GE
= 0 V, T
J
= 25 °C - - 5.0 mA
Gate to emitter leakage current I
GES
V
GE
= V
GES
, V
CE
= 0 V, T
J
= 25 °C - - 400 nA
SWITCHING CHARACTERISTICS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Turn-on delay time t
d(on)
V
CC
= 600 V, I
C
= 200 A, R
g
= 4.7 ,
V
GE
= ± 15 V, T
J
= 25 °C
- 577 -
ns
Rise time t
r
- 120 -
Turn-off delay time t
d(off)
- 540 -
Fall time t
f
- 123 -
Turn-on switching loss E
on
- 16.3 -
mJ
Turn-off switching loss E
off
- 12.0 -
Turn-on delay time t
d(on)
V
CC
= 600 V, I
C
= 200 A, R
g
= 4.7 ,
V
GE
= ± 15 V, T
J
= 125 °C
- 609 -
ns
Rise time t
r
- 121 -
Turn-off delay time t
d(off)
- 574 -
Fall time t
f
- 132 -
Turn-on switching loss E
on
- 22.0 -
mJ
Turn-off switching loss E
off
- 16.2 -
Input capacitance C
ies
V
GE
= 0 V, V
CE
= 30 V, f = 1.0 MHz
- 16.9 -
nFOutput capacitance C
oes
-1.51-
Reverse transfer capacitance C
res
-0.61-
SC data I
SC
t
sc
10 μs, V
GE
= 15 V, T
J
= 125 °C,
V
CC
= 600 V, V
CEM
1200 V
- 1800 - A
Internal gate resistance R
gint
-2.0-
Stray inductance L
CE
- - 18 nH
Module lead resistance, terminal to chip R
CC’+EE’
T
C
= 25 °C - 0.32 - m
DIODE ELECTRICAL SPECIFICATIONS (T
C
= 25 °C unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Diode forward voltage V
F
I
F
= 200 A
T
J
= 25 °C - 1.82 2.25
V
T
J
= 125 °C - 1.95 -
Diode reverse recovery charge Q
rr
I
F
= 200 A, V
R
= 600 V,
dI/dt = -1800 A/μs,
V
GE
= -15 V
T
J
= 25 °C - 13.1 -
μC
T
J
= 125 °C - 26.1 -
Diode peak reverse recovery current I
rr
T
J
= 25 °C - 123 -
A
T
J
= 125 °C - 172 -
Diode reverse recovery energy E
rec
T
J
= 25 °C - 7.0 -
mJ
T
J
= 125 °C - 12.9 -
VS-GB200TH120U
www.vishay.com
Vishay Semiconductors
Revision: 12-Jun-15
3
Document Number: 94754
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - IGBT Typical Output Characteristics
Fig. 2 - IGBT Typical Transfer Characteristics
Fig. 3 - IGBT Switching Loss vs. I
C
Fig. 4 - IGBT Switching Loss vs. R
g
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Operating junction temperature range T
J
- - 150
°C
Storage temperature range T
STG
-40 - 125
Junction to case
IGBT
R
thJC
- - 0.095
K/WDiode - - 0.140
Case to sink R
thCS
Conductive grease applied - 0.035 -
Mounting torque
Power terminal screw: M5 2.5 to 5.0
Nm
Mounting screw: M6 3.0 to 6.0
Weight 300 g
0
50
100
150
200
250
300
400
350
012345
V
CE
(V)
I
C
(A)
V
GE
= 15 V
25 °C
125 °C
0
50
100
150
200
250
300
400
350
4 5 6 7 8 9 10 11 12
V
GE
(V)
I
C
(A)
V
CE
= 20 V
125 °C
25 °C
0
10
20
30
40
50
60
70
80
0 100 200 300 400
I
C
(A)
E
on
, E
off
(mJ)
V
GE
= ± 15 V
T
J
= 125 °C
R
g
= 4.7 Ω
V
CC
= 600 V
E
off
E
on
0
30
60
90
120
150
0 10 20 30 40 50
R
g
(Ω)
V
GE
= ± 15 V
T
J
=
125 °C
I
C
= 200 A
V
CC
= 600 V
E
ON
, E
OFF
(mJ)
E
off
E
on

VS-GB200TH120U

Mfr. #:
Manufacturer:
Vishay Semiconductors
Description:
IGBT Modules Output & SW Modules - DIAP IGBT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet