VLM.33..
www.vishay.com
Vishay Semiconductors
Rev. 1.5, 03-Nov-15
9
Document Number: 81336
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
METHOD OF TAPING / POLARITY AND TAPE AND REEL
SMD LED (VLM3-SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO) 564) for automatic component insertion. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
TAPING OF VLM.3..
Fig. 23 - Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS)
Fig. 24 - Reel Dimensions - GS08
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS) PREFFERED
Fig. 25 - Reel Dimensions - GS18
SOLDERING PROFILE
Fig. 26 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
Fig. 27 - Double Wave Soldering of Opto Devices (all Packages)
Adhesive tape
Component cavity
Blister tape
94 8670
1.85
1.65
4.0
3.6
3.6
3.4
2.05
1.95
1.6
1.4
4.1
3.9
4.1
3.9
5.75
5.25
8.3
7.7
3.5
3.1
2.2
2.0
0.25
94 8668
180
178
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
14.4 max.
10.0
9.0
120°
94 8665
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
321
329
Identification
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
14.4 max.
10.4
8.4
120°
18857
Label:
Vishay
type
group
tape code
production
code
quantity
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19885
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
max. 2 cycles allowed
255 °C
235 °C
to 260 °C
2 K/s
ca. 200 K/s
second
wave
first wave
5 s
full line: typical
dotted line: process limits
Time (s)
Temperature (°C)
lead temperature
300
250
200
150
100
50
0
0 50 100 150 200 250
948626-1
TTW Soldering (acc. to CECC00802)
100 °C
to 130 °C
forced cooling
ca. 2 K/s
ca. 5 K/s
