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BAT54J,115

P1-P3P4-P6P7-P9
BAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 3 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: t
p
≤ 300 µs; δ≤0.02.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
- - 230 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
[3]
--55K/W
Table 7. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V
F
forward voltage
[1]
I
F
= 0.1 mA - - 240 mV
I
F
= 1 mA - - 320 mV
I
F
= 10 mA - - 400 mV
I
F
= 30 mA - - 500 mV
I
F
= 100 mA - - 800 mV
I
R
reverse current V
R
=25V --2 µA
C
d
diode capacitance V
R
= 1 V; f = 1 MHz - - 10 pF
BAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 4 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
(1) T
amb
= 125 °C
(2) T
amb
=85°C
(3) T
amb
=25°C
(1) T
amb
= 125 °C
(2) T
amb
=85°C
(3) T
amb
=25°C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
T
amb
=25°C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
10
3
10
2
10
−1
I
F
(mA)
V
F
(V)
10
1
1.20.80.40
msa892
(3)(2)(1)
(3)(2)(1)
0102030
V
R
(V)
10
3
10
2
10
−1
I
R
(µA)
10
1
(1)
(2)
(3)
msa893
0102030
0
5
10
15
V
R
(V)
C
d
(pF)
msa891
BAT54J_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 8 March 2007 5 of 8
NXP Semiconductors
BAT54J
Schottky barrier single diode
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
Fig 4. Package outline SOD323F (SC-90)
04-09-13Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3
1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
BAT54J SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 5. Reflow soldering footprint SOD323F (SC-90)
001aab169
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
P1-P3P4-P6P7-P9

BAT54J,115

Mfr. #:
Buy BAT54J,115
Manufacturer:
Nexperia
Description:
Schottky Diodes & Rectifiers DIODE SW TAPE-7
Lifecycle:
New from this manufacturer.
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