IRFBF30S

Document Number: 91389
www.vishay.com
S11-1055-Rev. C, 30-May-11 1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Power MOSFET
IRFBF30S, SiHFBF30S
Vishay Siliconix
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
Dynamic dV/dt Rating
Repetitive Avalanche Rated
•Fast Switching
Ease of Paralleling
Simple Drive Requirements
Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D
2
PAK (TO-263) package is universially preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the D
2
PAK (TO-263) contribute to
its wide acceptance throughout the industry.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V, starting T
J
= 25 °C, L = 36 mH, R
g
= 25 , I
AS
= 3.6 A (see fig. 12).
c. I
SD
3.6 A, dI/dt 70 A/μs, V
DD
600, T
J
150 °C.
d. 1.6 mm from case.
PRODUCT SUMMARY
V
DS
(V) 900
R
DS(on)
()V
GS
= 10 V 3.7
Q
g
(Max.) (nC) 78
Q
gs
(nC) 10
Q
gd
(nC) 42
Configuration Single
N-Channel MOSFET
G
D
S
D
2
PAK (TO-263)
G
D
S
ORDERING INFORMATION
Package D
2
PAK (TO-263)
Lead (Pb)-free and Halogen-free SiHFBF30S-GE3
Lead (Pb)-free
IRFBF30SPbF
SiHFBF30S-E3
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
900
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current V
GS
at 10 V
T
C
= 25 °C
I
D
3.6
A
T
C
= 100 °C 2.3
Pulsed Drain Current
a
I
DM
14
Linear Derating Factor 1.0 W/°C
Single Pulse Avalanche Energy
b
E
AS
250 mJ
Repetitive Avalanche Current
a
I
AR
3.6 A
Repetitive Avalanche Energy
a
E
AR
13 mJ
Maximum Power Dissipation T
C
= 25 °C P
D
125 W
Peak Diode Recovery dV/dt
c
dV/dt 1.5 V/ns
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature) for 10 s 300
d
* Pb containing terminations are not RoHS compliant, exemptions may apply
www.vishay.com Document Number: 91389
2 S11-1055-Rev. C, 30-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFBF30S, SiHFBF30S
Vishay Siliconix
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
thJA
-62
°C/WMaximum Junction-to-Ambient (PCB Mount)
a
R
thJA
-40
Maximum Junction-to-Case (Drain) R
thJC
-1.0
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0, I
D
= 250 μA 900 - - V
V
DS
Temperature Coefficient V
DS
/T
J
Reference to 25 °C, I
D
= 1 mA - 1.1 - V/°C
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.0 - 4.0 V
Gate-Source Leakage I
GSS
V
GS
= ± 20 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 900 V, V
GS
= 0 V - - 100
μA
V
DS
= 720 V, V
GS
= 0 V, T
J
= 125 °C - - 500
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 2.2 A
b
--3.7
Forward Transconductance g
fs
V
DS
= 100 V, I
D
= 2.2 A
b
2.3 - - S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
- 1200 -
pFOutput Capacitance C
oss
- 320 -
Reverse Transfer Capacitance C
rss
- 200 -
Total Gate Charge Q
g
V
GS
= 10 V
I
D
= 3.6 A, V
DS
= 360 V,
see fig. 6 and 13
b
--78
nC Gate-Source Charge Q
gs
--10
Gate-Drain Charge Q
gd
--42
Turn-On Delay Time t
d(on)
V
DD
= 450 V, I
D
= 3.6 A,
R
g
= 12 , R
D
= 120 , see fig. 10
b
-14-
ns
Rise Time t
r
-25-
Turn-Off Delay Time t
d(off)
-90-
Fall Time t
f
-30-
Internal Drain Inductance L
D
Between lead,
6 mm (0.25") from
package and center of
die contact
-4.5-
nH
Internal Source Inductance L
S
-7.5-
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--3.6
A
Pulsed Diode Forward Current
a
I
SM
--14
Body Diode Voltage V
SD
T
J
= 25 °C, I
S
= 3.6 A, V
GS
= 0 V
b
--1.8V
Body Diode Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= 3.6 A, dI/dt = 100 A/μs
b
- 430 650 ns
Body Diode Reverse Recovery Charge Q
rr
-1.42.1μC
Forward Turn-On Time t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
D
S
G
S
D
G
Document Number: 91389 www.vishay.com
S11-1055-Rev. C, 30-May-11 3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
IRFBF30S, SiHFBF30S
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Fig. 1 - Typical Output Characteristics, T
C
= 25 °C
Fig. 2 -Typical Output Characteristics, T
C
= 150 °C
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature

IRFBF30S

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 844-IRFBF30SPBF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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