Technical Data Sheet
7383/G1C3-ATVA/X/MS
Everlight Electronics Co., Ltd. http:\\www.everlight.com Rev :1 Page: 9 of 10
Device Number : DLE-0001280 Prepared date:04-16-2009 Prepared : Grace Shen
Although the recommended soldering conditions are specified in the above table, dip or
handsoldering at the lowest possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended
temperature and dwell time in the solder wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature
for a duration of no more than one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the
assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not
cause damage to the LED.
5. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of
LED application. The current should be de-rated appropriately by referring to the de-rating
curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer
to the data sheet de-rating curve.
6. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling
LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the
LEDs plastic lens as a result of friction between LEDs during storage and handing.
7. Other
Above specification may be changed without notice. EVERLIGHT will reserve authority
on material change for above specification.
