STPS10L45CT/CG/CF/CFP
4/7
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0.1
1.0
10.0
100.0
IFM(A)
VFM(V)
Tj=25°C
Tj=150°C
Typical values
Tj=125°C
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).
0 4 8 12 16 20 24 28 32 36 40
0
10
20
30
40
50
60
70
80
S(Cu) (cm²)
Rth(j-a) (°C/W)
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness: 35µm)( D
2
PAK).
0 5 10 15 20 25 30 35 40 45
1E-3
1E-2
1E-1
1E+0
1E+1
1E+2
VR(V)
IR(mA)
Tj=100°C
Tj=25°C
Tj=150°C
Tj=125°C
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
12 51020 50
10
100
1000
VR(V)
C(pF)
F=1MHz
Tj=25°C
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values, per diode).
