ADM2682E/ADM2687E Data Sheet
Rev. C | Page 22 of 24
OUTLINE DIMENSIONS
11-15-2011-A
16
9
81
SEATING
PLANE
COPLANARITY
0.1
1.27 BSC
12.85
12.75
12.65
7.60
7.50
7.40
2.64
2.54
2.44
1.01
0.76
0.51
0.30
0.20
0.10
10.51
10.31
10.11
0.46
0.36
2.44
2.24
PIN 1
MARK
1.93 REF
8°
0°
0.32
0.23
0.71
0.50
0.31
45°
0.25 BSC
GAGE
PLANE
COMPLIANT TO JEDEC STANDARDS MS-013-AC
Figure 48. 16-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC]
Wide Body,
(RI-16-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Data Rate (Mbps) Temperature Range Package Description Package Option
ADM2682EBRIZ 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
ADM2682EBRIZ-RL7 16 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
ADM2687EBRIZ 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
ADM2687EBRIZ-RL7 0.5 −40°C to +85°C 16-Lead SOIC_IC RI-16-2
EVAL-ADM2682EEBZ ADM2682E Evaluation Board
EVAL-ADM2687EEBZ ADM2687E Evaluation Board
1
Z = RoHS Compliant Part.
