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Revision: 31-Jan-17
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Document Number: 28396
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Table 10
Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the
lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability.
TEST PROCEDURES AND REQUIREMENTS
TEST
PROCEDURE
(quick reference)
REQUIREMENTS
NAME OF TEST REFERENCE
Mounting
IEC 60384-18,
subclause 4.3
Shall be performed prior to tests mentioned below;
reflow soldering;
for maximum temperature load refer to chapter “Mounting”
C/C: ± 5 %
tan spec. limit
I
L2
spec. limit
Endurance
IEC 60384-18 /
CECC 32300,
subclause 4.15
T
amb
= 125 °C; U
R
applied;
for test duration see Table 8
U
R
= 6.3 V; C/C: ± 25 %
U
R
10 V; C/C: ± 20 %
tan 2 x spec. limit
I
L2
spec. limit
Useful life
CECC 30301,
subclause 1.8.1
T
amb
= 125 °C; U
R
and I
R
applied;
for test duration see Table 8
C/C: ± 30 %
tan 3 x spec. limit
I
L2
spec. limit
no short or open circuit
total failure percentage: 1 %
Shelf life
(storage at high
temperature)
IEC 60384-18 /
CECC 32300,
subclause 4.17
T
amb
= 125 °C; no voltage applied;
1000 h
after test: U
R
to be applied for 30 min,
24 h to 48 h before measurement
For requirements
see “Endurance test” above
Reverse voltage
IEC 60384-18 /
CECC 32300,
subclause 4.16
T
amb
= 125 °C:
125 h at U = -0.5 V,
followed by 125 h at U
R
C/C: ± 15 %
tan 1.5 x spec. limit
I
L2
spec. limit