MC74VHC1G50
http://onsemi.com
2
MAXIMUM RATINGS (Note 1)
Symbol
Characteristics Value Unit
V
CC
DC Supply Voltage --0.5to+7.0 V
V
IN
DC Input Voltage --0.5to+7.0 V
V
OUT
DC Output Voltage V
CC
=0
High or Low State
--0.5to7.0
--0.5toV
CC
+0.5
V
I
IK
Input Diode Current -- 2 0 mA
I
OK
Output Diode Current V
OUT
< GND; V
OUT
>V
CC
+20 mA
I
OUT
DC Output Current, per Pin +25 mA
I
CC
DC Supply Current, V
CC
and GND +50 mA
P
D
Power dissipation in still air SC--88A, TSOP--5 200 mW
θ
JA
Thermal resistance SC--88A, TSOP--5 333 °C/W
T
L
Lead temperature, 1 mm from case for 10 s 260 °C
T
J
Junction temperature under bias +150 °C
T
stg
Storage temperature --65 to +150 °C
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
I
Latch--Up
Latch--Up Performance Above V
CC
and Below GND at 125°C(Note5) ±500 mA
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute--maximum--rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22--A114--A
3. Tested to EIA/JESD22--A115--A
4. Tested to JESD22--C101--A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
CC
DC Supply Voltage 2.0 5.5 V
V
IN
DC Input Voltage 0.0 5.5 V
V
OUT
DC Output Voltage 0.0 V
CC
V
T
A
Operating Temperature Range -- 5 5 +125 °C
t
r
,t
f
Input Rise and Fall Time V
CC
=3.3V± 0.3 V
V
CC
=5.0V± 0.5 V
0
0
100
20
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature °C
Time, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100
1000
TIME, YEARS
NORMALIZED FAILURE RATE
T
J
=80
C°
T
J
=90
C°
T
J
= 100 C°
T
J
=110 C°
T
J
= 130 C°
T
J
= 120 C°
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time
Junction Temperature