ADF5002
Rev. 0 | Page 3 of 12
SPECIFICATIONS
VDD1 = VDD2 = 3.3 V ± 10%, GND = 0 V; dBm referred to 50 Ω; T
A
= T
MIN
to T
MAX
, unless otherwise noted. Operating temperature
range is −40°C to +105°C.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
RF CHARACTERISTICS
Input Frequency 4 18 GHz
RF Input Sensitivity −10 +10 dBm 4 GHz to 18 GHz
Output Power −10 −5 dBm Single-ended output connected into a 50 Ω load
−7 −2 dBm
Differential outputs connected into a 100 Ω
differential load
Output Voltage Swing 200 330 mV p-p
Peak-to-peak voltage swing on each single-ended
output, connected into a 50 Ω load
400 660 mV p-p
Peak-to-peak voltage swing on differential
output, connected into a 100 Ω differential load
1000 mV p-p
Peak-to-peak voltage swing on each single-ended
output, no load condition
Phase Noise −153 dBc/Hz Input frequency (f
IN
) = 12 GHz, offset = 100 kHz
Reverse Leakage −60 dBm RF input power (P
IN
) = 0 dBm, RF
OUT
= 4 GHz
Second Harmonic Content −38 dBc
Third Harmonic Content −12 dBc
Fourth Harmonic Content −20 dBc
Fifth Harmonic Content −19 dBc
CE INPUT
Input High Voltage, V
IH
2.2 V
Input Low Voltage, V
IL
0.3 V
POWER SUPPLIES
Voltage Supply 3.0 3.3 3.6 V
I
DD
(I
DD1
+ I
DD2
)
Active 30 60 mA CE is high
Power-Down 7 25 mA CE is low
ADF5002
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VDDx to GND −0.3 V to +3.9 V
RFIN 10 dBm
Operating Temperature Range
Industrial (B Version) −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
LFCSP Thermal Impedance
Junction-to-Ambient (θ
JA
) 90°C/W
Junction-to-Case (θ
JC
) 30°C/W
Peak Temperature 260°C
Time at Peak Temperature 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
This device is a high performance RF integrated circuit with
an ESD rating of 2 kV, human body model (HBM), and is ESD
sensitive. Proper precautions should be taken for handling and
assembly.
ESD CAUTION
ADF5002
Rev. 0 | Page 5 of 12
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PADDLE MUST BE
CONNECTED TO GND.
G
G
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
1GND
2RFIN
3GND
4GND
11 RFOUT
12 GND
10 RFOUT
9GND
5
ND
6
NC
7
CE
8
ND
15
VDD
1
16
GND
14
VDD2
13
GND
TOP VIEW
(Not to Scale)
ADF5002
08753-002
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 5, 8, 9,
12, 13, 16
GND RF Ground. All ground pins should be tied together.
2 RFIN Single-Ended 50 Ω Input to the RF Prescaler. This pin is ac-coupled internally via a 3 pF capacitor.
6 NC No Connect. This pin can be left unconnected.
7 CE
Chip Enable. This pin is active high. When CE is brought low, the part enters power-down mode. If this
functionality is not required, the pin can be left unconnected because it is pulled up internally through
a weak pull-up resistor.
10 RFOUT
Divided-Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied to VDD2 and an
ac-coupling capacitor of 1 pF.
11
RFOUT
Complementary Divided-Down Output of the Prescaler. This pin has an internal 100 Ω load resistor tied
to VDD2 and an ac-coupling capacitor of 1 pF.
14 VDD2
Voltage Supply for the Output Stage. This pin should be decoupled to ground with a 0.1 μF capacitor in
parallel with a 10 pF capacitor and can be tied directly to VDD1.
15 VDD1
Voltage Supply for the Input Stage and Divider Block. This pin should be decoupled to ground with a
0.1 μF capacitor in parallel with a 10 pF capacitor.
EPAD The LFCSP has an exposed paddle that must be connected to GND.

ADF5002BCPZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Prescaler 4 GHz - 18 GHz Divide by 8
Lifecycle:
New from this manufacturer.
Delivery:
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