DLW32MH101XK2L

Spec. No. JEFL243C-9124-01 P7/9
MURATA MFG.CO., LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
13.6 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
13.7 Standard Land Dimensions (Reflow)
1 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be
occurred due to the spread of soldering paste or mount placeing accuracy.
2 If the pattern is made with wider, the strength of bending will be reduced.
Moreover, if the pattern is made with less than 2mm , in the worst case short circuit may be occurred.
3 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.
13.8 Standard Soldering Condition
1.Reflow Soldering
(1) Standard printing pattern of solder paste
Standerd thickness of the solder paste should be 150 µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard
land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
Spread of soldering paste between lines may cause short circuit of lines. (in mm)
Product
P.C.B.
Hole
×
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
*1
*2
Spec. No. JEFL243C-9124-01 P8/9
MURATA MFG.CO., LTD
Reference Only
(2) Soldering Temperature
Temperature difference between soldering and surface of components must be within 150°C,
in preheating. When components are immersed in liquid after soldering, temperature difference
should be within 100°C. If preheating is not enough, components may be cracked and cause deterioration
in insulation resistance.
(3) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
eterioration of product quality.
Soldering Profile for Lead Free solder (Sn-3.0Ag-0.5Cu solder )
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 240°C30s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
2. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes : Do not touch the products directly with the soldering iron.
3. Solder Volume
Solder shall be used not to be exceeded the upper limits.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
In case if the solder volume is much, we recommend to make the size of the solder paste
with less than the land pattern.
4.Solder fillet
Solder fillet in lateral direction is not formed in some case because of product's structure,
but it is not something that affects product's performance and reliability.
150
90s±30s Time(s)
245±3
Tem
p
.
()
220
3060s
180
260
240
30s max.
Limit Profile
Standard Profile
Spec. No. JEFL243C-9124-01 P9/9
MURATA MFG.CO., LTD
Reference Only
13.9 Caution for use
When you hold products with a tweezer, please hold
like a figure of the right side, and sharp material,
such as a pair of tweezers, shall not be touched to
the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products
mounted on the board to prevent the breaking
of the core.
13.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
13.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
13.12 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.13 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·Products should be stored in the warehouse on the following conditions.
Temperature -10 ~ +40°C
Humidity 15 to 85% relative humidity No rapid change on temperature and humidity.
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderability due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
tweezer

DLW32MH101XK2L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Common Mode Chokes / Filters 1210 50VDC 100uH 100mA AEC-Q200
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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