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TL Series
Modular Heat Sinkable
Thick Film Power
Thermal Resistance
Ultra* Std** Nominal Surge Load Max. Voltage Ohm Ultra Std.
Series Wattage Wattage Power (10 sec.) between terminals Range (10% tol.) (3%-5% tol.)
TL54 35 27 18 72 1000 0.3Ω - 1MΩ 1.26 1.67
TL71 96 71 48 192 2000 1.0Ω - 2MΩ 0.53 0.70
TL88 155 114 78 312 2500 1.5Ω - 3MΩ 0.34 0.45
TL104 215 158 108 432 2500 2.0Ω - 4MΩ 0.25 0.33
†TL122 275 202 137 548 2500 2.0Ω - 4MΩ
* For properly heat sinked, untrimmed resistors - see chart
** For properly heat sinked, trimmed resistors - see chart
† Power Ratings are theoretical. Consult Factory for details.
Operating voltage
1200 VAC
Dielectric Withstanding Voltage
2500 VAC
Resistive Element
Thick Film on Alumina
Housing
Aluminum
Insulators
Glass reinforced high temperature Valox®
Terminals
Tinned brass
Power Range
27 – 275 watts
Resistance Range
0.3Ω – 4MΩ
Tolerance
Ultra Power (U Style): ±10% std.
Standard Power: ±10% std.; 5% and 1% available
Temperature Coefficient
±250 PPM
Test Voltage for 1 Minute
6000 VDC/2500 VAC
Working Voltage
1200 VAC
External Creeping Distance
12mm
Temperature Limits
-40°C to +125°C
Insulation
>1002 MΩ/500V
Air Distance, Terminal to Ground
7mm
Inductance
50-100 nH
THIS PRODUCT IS
DESIGNED FOR USE WITH
PROPER HEATSINKING.
Maximum base plate temperature of the
resistor must be monitored and kept
within specified limits to establish the
power rating. Best technique is to attach
a thermocouple to the side of the base
plate of the resistor. Temperature of plastic
housing or heat sink cannot be used to
establish rating of the resistor.
The TL Series add heat sinkable options to the
thick film resistor family. The resistor element
is packaged with plastic insulators, and quick-
connect terminals in a symmetrical aluminum
profile for easy heat sink mounting. Special
tapped configurations are offered to reduce on
board component count.
Efficient thermal packaging provides improved
heat conduction to the heat sink. Self-insulating
package design increases voltage withstanding
characteristics when compared to traditional
aluminum housings. The in line mounting profile
makes the TL Series easily adaptable to most
heat sink systems. Thermal compound is always
recommended when heat sinking.
FEATURES
• Very low inductance
• Low profile design
• In-Line Mounting
Profile
•
1
/4” Quick connect ter-
minals
• Consult factory for
common, isolated, or
special multiple tap
options.
SERIES SPECIFICATIONS
APPLICATIONS
• Semiconductor Balancing
• Frequency Converters
• Snubber
• In-Rush Current Limiter
• Bleeder Resistor
• Power Switching
• Voltage Dividers
CHARACTERISTICS
(continued)