225
www.littelfuse.com
5
SILICON PROTECTION
CIRCUITS
SP0504BAC, SP0508BAC, SP0516BAC
TVS Diode Arrays
TVS Avalanche Diode Array in a Unipolar Chip Scale Package
SP0504BAC
6-bump
CSP Mechanical Specifications
The SP0504BAC
SP0504BAC
devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
CSP Tape and Reel Specifications
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 6
Dim
Millimeters Inches
Min Nom Max Min Nom Max
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 1.759 1.804 1.849 0.0693 0.0710 0.0728
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
B3 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.600 0.644 0.687 0.0236 0.0253 0.0271
D2 0.356 0.381 0.406 0.0140 0.0150 0.0160
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
1
2
3
B
C1
B1
A1
B2
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
B3
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL
P
0
P
1
1.804 X 1.154 X 0.644 1.98 X 1.32 X 0.91 8mm 178mm (7") 3500 4mm 4mm
To p
For tape feeder reference
Cover
Ta p e
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Ta
A
o
B
o
Mechanical Package Diagrams
