TGL41-12-E3/96

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TVS Diode Arrays
TVS Avalanche Diode Array in a Unipolar Chip Scale Package
SP0504BAC, SP0508BAC, SP0516BAC
This family of avalanche diode arrays are designed for ESD protection
and offered in an ultra small chip scale package.
The multi-channel devices are used to help protect sensitive digital or
analog input circuits on data, signal, or control lines with unipolar voltage
levels up to 5VDC.
The state-of-the-art structure is designed to suppress ESD and other
transient over-voltage events to meet the International Electrotechnical
Compatability (EMC transient immunity stantards IEC 61000-4-2 for
Electrostatic Discharge Requirements).
The monolithic silicon devices are comprised of specially designed
structures for transient voltage suppression (TVS). The size and
shape of these structures has been tailored for transient protection.
The low capacitance and clamp voltage are ideal for high speed signal
line protection.
Ordering Information
NOTE: Bump pitch is 0.65mm
Schematic
Features
An Array of 4, 8 and 16 Avalanche Diodes in a ultra small Chip Scale
Package (.65mm bump pitch)
ESD Capability per HBM Standards
- IEC 61000-4-2, Direct Discharge...............................25kV (Level 4)
- IEC 61000-4-2, Air Discharge....................................30kV (Level 4)
- MIL STD 833D (Method 3015.7) ..............................................30kV
Signal line protection for applications up to 5VDC
Fast response time...........................................................................< 1ns
Low input capacitance ..........................................................39pF Typical
Low clamp voltage ..................................................................12V Typical
Low input leakage.....................................................................10uA Max
Operating temperature range ............................................- 40°C to 85°C
Applications
Cell phone handsets
Personal Digital Assistants (PDA)
Portable handheld equipment (Laptop, Palmtop computers)
Computer port, keyboard (USB1.1)
Set-Top Box (Audio and Video Ports)
PCMCIA cards
MP3 players
Digital still cameras
Digital video cameras
PART
NUMBER
SP0504BACT
SP0508BACT
SP0516BACT
QUANTITY
PER REEL
3500
3500
3500
CS PACKAGE
SIZE (MM)
1.804 x 1.154
3.104 x 1.154
3.104 x 2.454
DIODE
CHANNELS
4
8
16
BUMPS
6
10
20
B1 B2 B3
A1 A2 A3
D1 D2 D3 D4 D5
C1 C2 C3 C4 C5
B1 B2 B3 B4 B5
A1 A2 A3 A4 A5
R1 R2 R3 R4 R5
A1 A2 A3 A4 A5
SP0504BAC
SP0516BAC
SP0508BAC
223
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SP0504BAC, SP0508BAC, SP0516BAC
TVS Avalanche Diode Array in a Unipolar Chip Scale Package
TVS Diode Arrays
PARAMETER
Reverse Standoff Voltage
Reverse Standoff Leakage Current
Signal Clamp Voltage
Positive
Negative
Clamp Voltage during ESD
MIL-STD-883D Method 3015
ESD Test Level
IEC-61000-4-2, Contact discharge
MIL-STD-883D Method 3015 (HBM)
Capacitance
Turn on/off Time
Temperature Range
Operating
Storage
TEST CONDITIONS
I = 10µA
V =TBD
I = 10mA
I = 10mA
8kV Positive
8kV Negative
2.5VDC @ 1Mhz
MIN
± 5.5
5.6
- 1.2
25
30
- 40
- 65
MAX
-
100
8.0
- 0.4
47
85
150
UNITS
V
nA
V
V
V
V
kV
kV
pF
ns
°C
°C
TYPICAL
-
6.8
- 0.8
12
- 8
39
<1
5
TVS DIODE ARRAYS
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.300mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.350mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.360mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance Edge To Corner Ball +
50µm
Solder Ball Side Coplanarity +
20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
.
Typical Solder Reflow Thermal Profile (No-Clean Flux)
0
48
97
Time (s)
145
194
242
290
339
387
435
EXH
CD
RF
Z
Z4
Z3
Z2
PH
EXH
250
225
200
175
150
125
100
75
50
25
Temperature (
o
C)
TVS Avalanche Diode Array in a Unipolar Chip Scale Package
SP0504BAC, SP0508BAC, SP0516BAC
TVS Diode Arrays
224
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32541
B
A
D
C
Orientation
Marking
32541
B
A
Orientation
Marking
321
B
A
Orientation
Marking
C3
D3
C2C1
D2D1
C5
D5
C4
D4
A3
B3
A2A1
B2B1
A5
B5
A4
B4
A3
B3
A2A1
B2B1
A5
B5
A4
B4
A3
B3
A2A1
B2B1
SP0504BAC
SP0508BAC
SP0516BAC
CSP Package
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
Solder Mask Opening
0.350mm DIA.
Non-Solder Mask Defined Pad
0.300mm DIA.
Solder Stencil Opening
0.360mm DIA.

TGL41-12-E3/96

Mfr. #:
Manufacturer:
Vishay
Description:
TVS DIODE 9.72V 17.3V DO213AB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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