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C40 Heat Sink System
For TO-247, TO-264 and SOT-227 Packages
The C40 Series Heat Sink System (Patent Pending)
offers flexible, high performance and compact heat
sinks with an exchangeable cam clip system for TO-
247, TO-264 and SOT-227 (clip in development)
devices. This powerful heat sink can be thru-hole
soldered in single or paired configurations. The paired
unit has mounting holes to accomodate a 40mm x
40mm fan. It is the ideal type of heat sink for high
power density and small size (1U or 2U) electronic
packaging with forced convection.
Paired Heat
Sink Mounting
With a FAN
Single
Mounting
CHARACTERISTICS
Heat Sink
Aluminum Alloy 6063-T5 or Equivalent with either degreased or black
anodized finish.
Spring Clip
Music Wire, Per ASTM A228 with bright nickel plating
Solder Foot
Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike.
RoHS compliant.
Fan
40mm fan with 4 self-tapping M3 screws
Interface Thermal
Resistance
For improvement, use thermal joint compound, 0.005 Grafoil (TGon
800 by Laird), or phase change material (Hi-Flow by Bergquist)
Insulator (Optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist
Heatsink Surface Area Weight Length L
Part Number (in
2
/ mm
2
) (oz / g) (mm)
C40-058-VE
63.8 / 41,180 2.5/ 71 58
C40-058-AE
SERIES SPECIFICATIONS
consult factory for
alternate lengths and
clip combinations
Fan Flow Rate (cfm)
10 20 300
Thermal Resistance from Case to
Ambient per Device (°C/watts)
2
0
2.5
3
1.5
1
0.5
2 devices
4 devices
Heat Dissipation
(continued)
