LIS344ALH Package information
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6 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level Interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK
®
is an ST trademark.
ECOPACK
®
specifications are available at: www.st.com.
Figure 21. LGA 16L: mechanical data and package dimensions
Dimensions
Ref.
mm inch
Min. Typ. Max. Min. Typ. Max.
A1 1.500 1.600 0.05910.0630
A2 1.330 0.0524
A3 0.160 0.200 0.240 0.0063 0.0079 0.0094
d0.300 0.0118
D1 3.850 4.000 4.150 0.1516 0.1575 0.16
34
E1 3.850 4.000 4.150 0.1516 0.1575 0.16
34
L2 1.950 0.0768
M 0.100 0.0039
N1 0.650 0.0256
N2 0.975 0.0384
P1 1.750 0.0689
P2 1.525 0.0600
T1 0.400 0.0157
T2 0.300 0.0118
k 0.050 0.0020
LGA 16L (4x4x1.5mm)
Land Grid Array Package
Outline and
7974136
mechanical data