DG9233EDQ-T1-GE3

NOTES:
1. Die thickness allowable is 0.203"0.0127.
2. Dimensioning and tolerances per ANSI.Y14.5M-1994.
3. Dimensions “D” and “E
1
” do not include mold flash or protrusions, and are
measured at Datum plane -H- , mold flash or protrusions shall not exceed
0.15 mm per side.
4. Dimension is the length of terminal for soldering to a substrate.
5. Terminal positions are shown for reference only.
6. Formed leads shall be planar with respect to one another within 0.10 mm at
seating plane.
7. The lead width dimension does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the lead width
dimension at maximum material condition. Dambar cannot be located on the
lower radius or the lead foot. Minimum space between protrusions and an
adjacent lead to be 0.14 mm. See detail “B” and Section “C-C”.
8. Section “C-C” to be determined at 0.10 mm to 0.25 mm from the lead tip.
9. Controlling dimension: millimeters.
10. This part is compliant with JEDEC registration MO-187, variation AA and BA.
11. Datums -A- and -B- to be determined Datum plane -H- .
12. Exposed pad area in bottom side is the same as teh leadframe pad size.
5
N N-1
A B C 0.20
(N/2) Tips)
2X
N/221
0.60
0.50
0.60
E
Top View
e
See Detail “B”
-H-
3
D
-A-
Seating Plane
A
1
A
6
C0.10
Side View
0.25
BSC
T
4
L
-C-
Seating Plane
0.07 R. Min
2 Places
Parting Line
Detail “A”
(Scale: 30/1)
0.48 Max
Detail “B”
(Scale: 30/1)
Dambar Protrusion
7
C0.08
M
B
S
A
S
b
b
1
With Plating
Base Metal
c
1
c
Section “C-C”
Scale: 100/1
(See Note 8)
See Detail “A”
A
2
0.05
S
C
C
ς
3
E
1
-B-
End View
e1
0.95
Package Information
Vishay Siliconix
Document Number: 71244
12-Jul-02
www.vishay.com
1
MSOP: 8−LEADS
JEDEC Part Number: MO-187, (Variation AA and BA)
N = 8L
MILLIMETERS
Dim Min Nom Max
Note
A
- - 1.10
A
1
0.05 0.10 0.15
A
2
0.75 0.85 0.95
b
0.25 - 0.38 8
b
1
0.25 0.30 0.33 8
c
0.13 - 0.23
c
1
0.13 0.15 0.18
D
3.00 BSC 3
E
4.90 BSC
E
1
2.90 3.00 3.10 3
e
0.65 BSC
e
1
1.95 BSC
L
0.40 0.55 0.70 4
N
8 5
T
0_ 4_ 6_
ECN: T-02080—Rev. C, 15-Jul-02
DWG: 5867
Application Note 826
Vishay Siliconix
www.vishay.com Document Number: 72606
22 Revision: 21-Jan-08
APPLICATION NOTE
RECOMMENDED MINIMUM PADS FOR SO-8
0.246
(6.248)
Recommended Minimum Pads
Dimensions in Inches/(mm)
0.172
(4.369)
0.152
(3.861)
0.047
(1.194)
0.028
(0.711)
0.050
(1.270)
0.022
(0.559)
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Vishay
Revision: 08-Feb-17
1
Document Number: 91000
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DG9233EDQ-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
Analog Switch ICs Dual SPST Switch 1pC charge injection
Lifecycle:
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