MCR12DCNT4

© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 5
1 Publication Order Number:
MCR12DCM/D
MCR12DCM, MCR12DCN
Preferred Device
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed for high volume, low cost, industrial and consumer
applications such as motor control; process control; temperature, light
and speed control.
Features
Small Size
Passivated Die for Reliability and Uniformity
Low Level Triggering and Holding Characteristics
Epoxy Meets UL 94 V−0 @ 0.125 in
ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
Pb−Free Packages are Available
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Peak Repetitive Off−State Voltage (Note 1)
(T
J
= −40 to 125°C, Sine Wave, 50 to 60 Hz,
Gate Open) MCR12DCM
MCR12DCN
V
DRM,
V
RRM
600
800
V
On−State RMS Current
(180° Conduction Angles; T
C
= 90°C)
I
T(RMS)
12 A
Average On−State Current
(180° Conduction Angles; T
C
= 90°C)
I
T(AV)
7.8 A
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave 60 Hz, T
J
= 125°C)
I
TSM
100 A
Circuit Fusing Consideration (t = 8.3 msec) I
2
t 41 A
2
sec
Forward Peak Gate Power
(Pulse Width 1.0 sec, T
C
= 90°C)
P
GM
5.0 W
Forward Average Gate Power
(t = 8.3 msec, T
C
= 90°C)
P
G(AV)
0.5 W
Forward Peak Gate Current
(Pulse Width 1.0 sec, T
C
= 90°C)
I
GM
2.0 A
Operating Junction Temperature Range T
J
40 to 125 °C
Storage Temperature Range T
stg
40 to 150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. V
DRM
for all types can be applied on a continuous basis. Ratings apply for zero
or negative gate voltage; positive gate voltage shall not be applied concurrent
with negative potential on the anode. Blocking voltages shall not be tested
with a constant current source such that the voltage ratings of the device are
exceeded.
SCRs
12 AMPERES RMS
600 − 800 VOLTS
Preferred devices are recommended choices for future use
and best overall value.
K
G
A
PIN ASSIGNMENT
1
2
3
Anode
Gate
Cathode
4
Anode
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
DPAK
CASE 369C
STYLE 4
MARKING DIAGRAM
Y = Year
WW = Work Week
R12DCx = Device Code
x= M or N
G = Pb−Free Package
1
2
3
4
YWW
R1
2DCxG
MCR12DCM, MCR12DCN
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance − Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 2)
R
JC
R
JA
R
JA
2.2
88
80
°C/W
Maximum Lead Temperature for Soldering Purposes (Note 3) T
L
260 °C
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(V
AK
= Rated V
DRM
or V
RRM
, Gate Open) T
J
= 25°C
T
J
= 125°C
I
DRM,
I
RRM
0.01
5.0
mA
ON CHARACTERISTICS
Peak Forward On−State Voltage (Note 4) (I
TM
= 20 A) V
TM
1.3 1.9 V
Gate Trigger Current (Continuous dc)
(V
D
= 12 V, R
L
= 100 )T
J
= 25°C
T
J
= *40°C
I
GT
2.0
7.0
20
40
mA
Gate Trigger Voltage (Continuous dc)
(V
D
= 12 V, R
L
= 100 )T
J
= 25°C
T
J
= *40°C
V
GT
0.5
0.65
1.0
2.0
V
Gate Non−Trigger Voltage
(V
D
= 12 V, R
L
= 100 )T
J
= 125°C
V
GD
0.2 V
Holding Current
(V
D
= 12 V, Initiating Current = 200 mA, Gate Open) T
J
= 25°C
T
J
= −40°C
I
H
4.0
22
40
80
mA
Latching Current
(V
D
= 12 V, I
G
= 20 mA, T
J
= 25°C)
(V
D
= 12 V, I
G
= 40 mA, T
J
= −40°C)
I
L
4.0
22
40
80
mA
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off−State Voltage
(V
D
= Rated V
DRM
, Exponential Waveform, Gate Open, T
J
= 125°C)
dv/dt
50 200
V/s
2. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
3. 1/8 from case for 10 seconds.
4. Pulse Test: Pulse Width 2.0 msec, Duty Cycle 2%.
ORDERING INFORMATION
Device Package Shipping
MCR12DCMT4 DPAK 2500 / Tape and Reel
MCR12DCMT4G DPAK
(Pb−Free)
2500 / Tape and Reel
MCR12DCNT4 DPAK 2500 / Tape and Reel
MCR12DCNT4G DPAK
(Pb−Free)
2500 / Tape and Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MCR12DCM, MCR12DCN
http://onsemi.com
3
+ Current
+ Voltage
V
TM
I
DRM
at V
DRM
I
H
Symbol Parameter
V
DRM
Peak Repetitive Off−State Forward Voltage
I
DRM
Peak Forward Blocking Current
V
RRM
Peak Repetitive Off−State Reverse Voltage
I
RRM
Peak Reverse Blocking Current
V
TM
Peak On−State Voltage
I
H
Holding Current
Voltage Current Characteristic of SCR
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode −
Forward Blocking Region
I
RRM
at V
RRM
(off state)
90°
60°
Figure 1. Average Current Derating Figure 2. On−State Power Dissipation
8.00
I
T(AV)
, AVERAGE ON−STATE CURRENT (AMPS)
125
120
115
I
T(AV)
, AVERAGE ON−STATE CURRENT (AMPS)
3.0 8.00
8.0
4.0
2.0
0
T
C
, MAXIMUM ALLOWABLE CASE TEMPERATURE ( C)
P
110
85
1.0 2.0 3.0 1.0 2.0
6.0
16
°
, AVERAGE POWER DISSIPATION (WATTS)
(AV)
dc
180°120°
90°
= 30°
dc
180°
120°
= 30°
5.0
4.0 5.0
105
4.0
= Conduction
Angle
= Conduction
Angle
100
95
90
6.0 7.0
10
12
14
6.0 7.0
60°
Figure 3. On−State Characteristics Figure 4. Transient Thermal Response
5.00
V
T
, INSTANTANEOUS ON−STATE VOLTAGE (VOLTS)
100
10
1.0
0.1
t, TIME (ms)
1.00.1
1.0
0.1
0.01
4.0
I
r
(t)
, TRANSIENT RESISTANCE
1.0 3.0 10 100 1000 10
K
, INSTANTANEOUS ON−STATE CURRENT (AMPS)
T
TYPICAL @ T
J
= 25°C
MAXIMUM @ T
J
= 25°C
MAXIMUM @ T
J
= 125°C
Z
JC(t)
= R
JC(t)
Sr(t)
2.0
(NORMALIZED)

MCR12DCNT4

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
THYRISTOR SCR 12A 800V DPAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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