13
AT24C512
1116M–SEEPR–05/05
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM marketing.
Ordering Information
(1)
Ordering Code Package Operation Range
AT24C512C1-10CI-2.7
AT24C512-10PI-2.7
AT24C512W-10SI-2.7
AT24C512N-10SI-2.7
AT24C512-10TI-2.7
8CN1
8P3
8S2
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C512C1-10CI-1.8
AT24C512-10PI-1.8
AT24C512W-10SI-1.8
AT24C512N-10SI-1.8
AT24C512-10TI-1.8
8CN1
8P3
8S2
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C512C1-10CU-2.7
(2)
AT24C512C1-10CU-1.8
(2)
AT24C512-10PU-2.7
(2)
AT24C512-10PU-1.8
(2)
AT24C512W-10SU-2.7
(2)
AT24C512W-10SU-1.8
(2)
AT24C512N-10SU-2.7
(2)
AT24C512N-10SU-1.8
(2)
AT24C512-10TU-2.7
(2)
AT24C512-10TU-1.8
(2)
AT24C512Y4-10YU-1.8
(2)
AT24C512U4-10UU-1.8
(2)
8CN1
8CN1
8P3
8P3
8S2
8S2
8S1
8S1
8A2
8A2
8Y4
8U4-1
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C512-W2.7-11
(3)
AT24C512-W1.8-11
(3)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Package Type
8CN1 8-lead, 0.300" Wide, Leadless Array Package (LAP)
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S2 8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y4 8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8U4-1 8-ball, die Ball Grid Array Package (dBGA2)
Options
–2.7 Low-voltage (2.7V to 5.5V)
–1.8 Low-voltage (1.8V to 3.6V)
