CREAT BY ART
- Glass passivated chip junction
- High current capability, Low VF
- High reliability
- High surge current capability
- Low power loss
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
Cj pF
R
θjA
O
C/W
T
J
O
C
T
STG
O
C
Note 1: Pulse Test with PW=300μs, 1% Duty Cycle
Document Number: DS_D1405025 Version: E14
6A05G thru 6A100G
Taiwan Semiconductor
Glass Passivated Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
UNIT
MECHANICAL DATA
Case: R-6
R-6
Weight: 1.65 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL
6A
05G
6A
10G
I
FSM
250
6A
40G
6A
60G
6A
80G
6A
100G
6A
20G
A
Maximum instantaneous forward voltage (Note 1)
@ 6 A
V
F
V
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 6
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Note 2: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Typical junction capacitance (Note 2)
Typical thermal resistance 35
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃
I
R
10
μA
100
1.1 1.0
60
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
