Characteristics STPS3L40
4/9 DocID7128 Rev 4
Figure 7. Normalized avalanche power derating
versus junction temperature
Figure 8. Relative variation of thermal
impedance junction to ambient versus pulse
duration - SMC
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j
)
P (25°C)
ARM
ARM
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-c) th(j-c)
T
δ
=tp/T
tp
t (s)
p
Single pulse
SMC
Figure 9. Relative variation of thermal
impedance junction to lead versus pulse
duration - SMBflat
Figure 10. Reverse leakage current versus
reverse voltage applied (typical values)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z/R
th(j-l) th(j-l)
SMB flat
t (s)
p
Single pulse
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40
I (mA)
R
V (V)
R
T=125°C
j
T=100°C
j
T=25°C
j
Figure 11. Junction capacitance versus reverse
voltage applied (typical values)
Figure 12. Forward voltage drop versus forward
current
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T=25°C
OSC RMS
j
I (A)
FM
0.01
0.10
1.00
10.00
100.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
T
j
=25°C
(Maximum values)
T
j
=125 °C
(Typical values)
T
j
=125 °C
(Typical values)
T
j
=125 °C
(Maximum values)
T
j
=125 °C
(Maximum values)
V (V)
FM
