GS1AFL
THRU
GS1MFL
1.0 Amp Glass
Passivated Rectifier
50 to 1000 Volts
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 13°C/W Junction To Lead
MCC
Catalog
Number
Device
Marking
Maximum
Reccurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
GS1AFL GS1A50V35V50V
GS1BFL GS1B100V70V100V
GS1DFL GS1D200V140V200V
GS1GFL GS1G400V280V400V
GS1JFL GS1J600V420V600V
GS1KFL GS1K800V560V800V
GS1MFL GS1M1000V700V1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
I
F(AV)
1.0A
T
L
= 110°C
Peak Forward Surge
Current
I
FSM
30A 8.3ms, half sine,
Maximum
Instantaneous
Forward Voltage
V
F
1.0V
I
FM
= 1.0A;
T
J
= 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
I
R
10µA
50µA
T
J
= 25°C
T
J
= 125°C
Typical Junction
Capacitance
C
J
15pF Measured at
1.0MHz, V
R
=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
omponents
20736 Marilla Street Chatsworth
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• Extremely Low Thermal Resistance
• High Temp Soldering: 260°C for 10 Seconds At Terminals
Revision: E 2015/08/18
x Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Note 1: High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
www.mccsemi.com
1 of 4
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A . . 7 0 1.20
E .0 .
C .004 .01 0.10 0.
D .0 . .
E .173 .2 4.40 5.
( . 126 .3.20
/ .028 .0 0 1.
SUGGESTED SOLDER
PAD LAYOUT
(
SMA-FL
)
DO-221AC
• Halogen free available upon request by adding suffix "-HF"
Features
0.075
(1.9)
0.063
(1.6)
0.232
(5.9)
0.106
(2.7)
Micro Commercial Components
M C C
TM
