SBR3U30P1-7

SBR3U30P1
3.0A SBR
®
SUPER BARRIER RECTIFIER
PowerDI
®
123
Features
Ultra Low Forward Voltage Drop
Superior Reverse Avalanche Capability
Patented Interlocking Clip Design for High Surge Current
Capacity
Patented Super Barrier Rectifier Technology
Soft, Fast Switching Capability
150ºC Operating Junction Temperature
±16KV ESD Protection (HBM, 3B)
±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: PowerDI
®
123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Polarity Indicator: Cathode Band
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.018 grams (approximate)
Top View
Maximum Ratings @T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
RM
30 V
RMS Reverse Voltage
V
R(RMS)
21 V
Average Rectified Output Current (See Figure 1)
I
O
3.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
I
FSM
75 A
Non-Repetitive Avalanche Energy
(T
J
= 25°C, I
AS
= 5A, L = 8.5 mH)
E
AS
105 mJ
Repetitive Peak Avalanche Energy
(1µs, 25°C)
P
ARM
1100 W
Thermal Characteristics
Characteristic Symbol Value Unit
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
R
θ
JS
R
θ
JA
R
θ
JA
5
178
123
ºC/W
Operating and Storage Temperature Range (Note 5)
T
J
, T
STG
-65 to +150 ºC
Notes: 1. RoHS revision 13.2.2003. High temperature solder exemption applied, see EU Directive Annex Note 7.
2. Theoretical R
θJS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
SBR and PowerDI are registered trademark of Diodes Incorporated.
SBR3U30P1
Document number: DS30974 Rev. 6 - 2
1 of 4
www.diodes.com
October 2008
© Diodes Incorporated
SBR3U30P1
Document number: DS30974 Rev. 6 - 2
2 of 4
www.diodes.com
October 2008
© Diodes Incorporated
SBR3U30P1
BR and PowerDI are registered trademark of Diodes Incorporated.
Electrical Characteristics @T
A
= 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 5)
V
(BR)R
30 - - V
I
R
= 400µA
Forward Voltage Drop
V
F
-
0.28
0.31
0.39
0.20
0.23
0.35
0.32
0.35
0.43
0.23
0.26
0.38
V
I
F
= 0.5A, T
J
= 25ºC
I
F
= 1.0A, T
J
= 25ºC
I
F
= 3.0A, T
J
= 25ºC
I
F
= 0.5A, T
J
= 125ºC
I
F
= 1.0A, T
J
= 125ºC
I
F
= 3.0A, T
J
= 125ºC
Leakage Current (Note 5)
I
R
-
70
150
6
12
150
400
15
20
µA
µA
mA
mA
V
R
= 5V, T
J
= 25ºC
V
R
= 30V, T
J
= 25ºC
V
R
= 5V, T
J
= 125ºC
V
R
= 30V, T
J
= 125ºC
Notes: 5. Short duration pulse test used to minimize self-heating effect.
Fig. 1 Forward Power Dissipation
0
0.2
0.4
0.6
0.8
1
1.2
0123
I , AVERAGE FORWARD CURRENT (A)
F(AV)
4
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N
(W)
D
Fig. 2 Typical Forward Characteristics
0.1
1
10
100
1,000
10,000
0 0.2 0.4 0.6 0.8
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
I , INSTANTANEOUS FORWARD CURRENT (mA)
F
T=25C
A
°
T= -65C
A
°
T =100 C
A
°
T=150C
A
°
Fig. 3 Typical Reverse Characteristics
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0 5 10 15 20 25 30
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
I , INSTANTANEOUS REVERSE CURRENT (mA)
R
T =100 C
A
°
T =150 C
A
°
T=25C
A
°
T= -65C
A
°
Fig. 4 Total Capacitance vs. Reverse Voltage
1
10
100
1,000
10,000
0 5 10 15 20 25 30
V , DC REVERSE VOLTAGE (V)
R
C , TOTAL CAPACITANCE (pF)
T
f = 1.0MHz
S
SBR3U30P1
Document number: DS30974 Rev. 6 - 2
3 of 4
www.diodes.com
October 2008
© Diodes Incorporated
SBR3U30P1
BR and PowerDI are registered trademark of Diodes Incorporated.
0
1.0
2.0
4.0
3.0
5.0
025
50
75 100
125 150
175 200
I, AVE
R
A
G
E
F
O
R
WA
R
D
C
U
R
R
EN
T
(A)
F(AV)
T , AMBIENT TEMPERATURE (°C)
Fig. 5 Forward Current Derating Curve
A
60
80
70
160
150
140
130
120
110
100
90
0
10
20 30
T
, DE
R
A
T
ED AMBIEN
T
T
EM
P
E
R
A
T
U
R
E (°
C
)
A
V , DC REVERSE VOLTAGE (V)
Fig. 6 Operating Temperature Derating
R
5
15 25
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
T , JUNCTION TEMPERATURE ( C)
J
°
P , AVALANCHE PEAK PULSE POWER
DERATING IN PERCENTAGE (%)
ARM
Fig. 7 Pulse Derating Curve
1
10
100
1,000
10,000
0.001 0.01 0.1 1 10 100 1,000
P
, MAXIM
U
M AVALA
N
C
H
E
P
O
WE
R
(W)
ARM
Fig. 8 Maximum Avalanche Power Curve
T , PULSE DURATION (uS)
P
S

SBR3U30P1-7

Mfr. #:
Manufacturer:
Diodes Incorporated
Description:
Schottky Diodes & Rectifiers 3A 30V Ultralow VF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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