ZL40219 Data Sheet
13
Microsemi Corporation
Figure 16 - LVDS AC Output Termination for CML Inputs
CML
Receiver
VDD
Z
o
= 50 Ohms
Z
o
= 50 Ohms
ZL40219
clk_p
clk_n
VDD_Rx
50 Ohms
50 Ohms
ZL40219 Data Sheet
14
Microsemi Corporation
3.3 Device Additive Jitter
The ZL40219 clock fanout buffer is not intended to filter clock jitter. The jitter performance of this type of device is
characterized by its additive jitter. Additive jitter is the jitter the device would add to a hypothetical jitter-free clock as
it passes through the device. The additive jitter of the ZL40219 is random and as such it is not correlated to the jitter
of the input clock signal.
The square of the resultant random RMS jitter at the output
of the ZL40219 is equal to the sum of the squares of the
various random RMS jitter sources including: input clock jitter; additive jitter of the buffer; and additive jitter due to
power supply noise. There may be additional deterministic jitter sources, but they are not shown in Figure 17.
+
J
in
2
J
add
2
J
ps
2
J
in
= Random input clock jitter (RMS)
J
add
= Additive jitter due to the device (RMS)
J
ps
= Additive jitter due to power supply noise (RMS)
J
out
= Resultant random output clock jitter (RMS)
+
J
out
2
= J
in
2
+J
add
2
+J
ps
2
Figure 17 - Additive Jitter
ZL40219 Data Sheet
15
Microsemi Corporation
3.4 Power Supply
This device operates employing either a 2.5V supply or 3.3V supply.
3.4.1 Sensitivity to power supply noise
Power supply noise from sources such as switching power supplies and high-power digital components such as
FPGAs can induce additive jitter on clock buffer outputs. The ZL40219 is equipped with an on-chip linear power
regulator and on-chip bulk capacitors to minimize additive jitter due to power supply noise. The on-chip measures in
combination with the simple recommended power supply filtering and PCB layout minimize additive jitter from
power supply noise.
3.4.2 Power supply filtering
Jitter levels may increase when noise is present on the power pins. For optimal jitter performance, the device
should be isolated from the power planes connected to its power supply pins as shown in Figure •.
10 µF capacitors should be size 0603 or size 080
5 X5R or X7R ceramic, 6.3 V minimum rating
0.1 µF capacitors should be
size 0402 X5R ceramic, 6.3 V minimum rating
Capacitors should be placed next to the
connected device power pins
A 0.3 ohm resistor is recommended
ZL40219
1
8
9
19
22
32
0.1 µF
0.1 µF
vdd_core
10 µF
0.1 µF
0.15
vdd
0.1 µF
10 µF
Figure 18 - Decoupling Connections for Power Pins
3.4.3 PCB layout considerations
The power nets in Figure 18 can be implemented either as a plane island or routed power topology without effect
overall jitter performance of the device.

ZL40219LDG1

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Clock Buffer 1:8 LVDS Fanout Buffer w/Int. Term.
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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