DMN25D0UFA-7B

DMN25D0UFA
Document number: DS36253 Rev. 1 - 2
1 of 6
www.diodes.com
February 2014
© Diodes Incorporated
DMN25D0UFA
25V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V
(BR)DSS
R
DS(on)
I
D
T
A
= +25°C
25V
4 @ V
GS
= 4.5V
0.32A
5 @ V
GS
= 2.7V
0.28A
Description
This MOSFET has been designed to minimize the on-state resistance
(R
DS(ON)
) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
Applications
Load switch
Portable applications
Power Management Functions
Features
0.4mm ultra low profile package for thin application
0.48mm
2
package footprint, 16 times smaller than SOT23
Low V
GS(th),
can be driven directly from a battery
Low R
DS(on)
ESD Protected Gate (>6kV Human Body Mode)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: X2-DFN0806-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Weight: 0.00043 grams (approximate)
Ordering Information (Note 4)
Part Number Compliance Case Packaging
DMN25D0UFA-7B Standard X2-DFN0806-3 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Equivalent Circuit
Bottom View
Top View
Package Pin Configuration
56 = Product Type Marking Code
DMN25D0UFA-7B
Top View
Bar Denotes Gate
and Source Side
X2-DFN0806-3
Source
Body
Diode
Gate
Protection
Diode
Gate
Drain
56
ESD HBM >6kV
e4
DMN25D0UFA
Document number: DS36253 Rev. 1 - 2
2 of 6
www.diodes.com
February 2014
© Diodes Incorporated
DMN25D0UFA
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Drain-Source Voltage
V
DSS
25
V
Gate-Source Voltage
V
GSS
8
Continuous Drain Current, V
GS
= 4.5V
(Note 6)
I
D
0.32
A
T
A
= +70°C (Note 6)
0.25
(Note 5)
I
D
0.24 A
Pulsed Drain Current (Note 7)
I
DM
1.2 A
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation
(Note 6)
P
D
0.63
W
(Note 5) 0.28
Thermal Resistance, Junction to Ambient
(Note 6)
R
JA
201
°C/W
(Note 5) 338
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
25
— V
V
GS
= 0V, I
D
= 250A
Zero Gate Voltage Drain Current
I
DSS
1 µA
V
DS
= 20V, V
GS
= 0V
Gate-Source Leakage
I
GSS
— —
100 nA
V
GS
= 8V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
0.6
1.2 V
V
DS
= V
GS
, I
D
= 250A
Static Drain-Source On-Resistance
R
DS(on)
4
V
GS
= 4.5V, I
D
= 0.4A
5
V
GS
= 2.7V, I
D
= 0.2A
Forward Transfer Admittance
|Y
fs
|
1 - S
V
DS
= 5V, I
D
= 0.4A
Diode Forward Voltage
V
SD
0.76 1.2 V
V
GS
= 0V, I
S
= 0.29A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
C
iss
— 27.9 —
pF
V
DS
= 10V, V
GS
= 0V,
f = 1MHz
Output Capacitance
C
oss
— 6.1 —
pF
Reverse Transfer Capacitance
C
rss
— 2 —
pF
Gate Resistance
R
g
— 26.4 —
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge
Q
g
— 0.36 —
nC
V
DS
= 5V, V
GS
= 4.5V,
I
D
= 0.2A
Gate-Source Charge
Q
gs
— 0.06 —
nC
Gate-Drain Charge
Q
gd
— 0.04 —
nC
Turn-On Delay Time
t
D(on)
— 2.9 —
ns
V
DS
= 6V, V
GS
= 4.5V,
I
D
= 0.5A, R
G
= 50
Turn-On Rise Time
t
r
— 1.8 —
ns
Turn-Off Delay Time
t
D(off)
— 6.6 —
ns
Turn-Off Fall Time
t
f
— 2.3 —
ns
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN25D0UFA
Document number: DS36253 Rev. 1 - 2
3 of 6
www.diodes.com
February 2014
© Diodes Incorporated
DMN25D0UFA
V , DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
DS
I, D
R
AIN
C
U
R
R
EN
T
(A)
D
0.0
0.1
0.2
0.3
0.4
0.5
0 0.5 1 1.5 2 2.5 3
V= 1.2V
GS
V= 1.5V
GS
V= 2.0V
GS
V= 2.5V
GS
V= 3.0V
GS
V= 8.0V
GS
V= 4.5V
GS
V= 4.0V
GS
V= 3.5V
GS
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 2 Typical Transfer Characteristics
I, D
R
AI
N
C
U
R
R
E
N
T
(A)
D
0
0.1
0.2
0.3
0.4
0.5
0 0.5 1 1.5 2 2.5 3
V = 5.0V
DS
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
I , DRAIN-SOURCE CURRENT (A)
D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
R
, D
R
AIN-S
O
U
R
CE
O
N-
R
ESISTANCE ( )
DS(ON)
Ω
0.5
0.6
0.7
0.8
0.9
1
0 0.1 0.2 0.3 0.4 0.5
V = 4.5V
GS
V = 2.7V
GS
V , GATE-SOURCE VOLTAGE (V)
GS
Figure 4 Typical Transfer Characteristics
R
, D
R
AI
N
-S
O
U
R
C
E
O
N
-
R
ESIS
T
A
N
C
E ( )
DS(ON)
Ω
0.6
0.8
1
1.2
1.4
1.6
1.8
2
012345678
I = 400mA
D
I = 200mA
D
I , DRAIN CURRENT (A)
D
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
R
, D
R
AIN-S
O
U
R
CE
O
N-
R
ESISTANCE ( )
DS(ON)
Ω
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0 0.1 0.2 0.3 0.4 0.5
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
V = 4.5V
GS
T , JUNCTION TEMPERATURE ( C)
Figure 6 On-Resistance Variation with Temperature
J
°
R
, D
R
AIN-S
O
U
R
C
E
ON-RESISTANCE (NORMALIZED)
DS(ON)
0.4
0.8
1.2
1.6
2
-50 -25 0 25 50 75 100 125 150
V= V
I = 100mA
GS
D
2.7
V= V
I= 500mA
GS
D
4.5

DMN25D0UFA-7B

Mfr. #:
Manufacturer:
Diodes Incorporated
Description:
MOSFET 25V N-Ch ENH FET 25Vds 8Vgs 0.63W
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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