I
NTEGRATED
C
IRCUITS
D
IVISION
R02 www.ixysic.com 4
CYG2110
2 Manufacturing Information
2.1 Handling and Assembly Recommendations
The CYG2110 is not hermetically sealed, and should not be exposed to any liquid-based rinsing processes. IXYS
Integrated Circuits Division recommends two (2) approaches: (1) the modem should be installed in a wave-soldering
process that uses a no-clean soldering flux that will mostly evaporate during the normal wave-soldering processes,
(2) the modem should be soldered in by hand after the rest of the card is wave-soldered.
2.2 Reflow Profile
This product has a maximum solder temperature as shown below.
2.3 Mechanical Dimensions
2.3.1 CYG2110
Device Maximum Temperature
CYG2110 260°C
LINE 1 (PIN 1)
LINE 2
RING
MUTE
OH
GND
V
CC
RING
TIP
27.18
(1.070)
27.18
(1.070)
10.16
(0.400)
0.634 SQ.
(0.025)
TYP.
SIDE VIEWTOP VIEW
3.18
(0.125)
PCB Pattern
(Top View)
Dimensions
mm
(inches)
2.54
(0.100)
typ.
21.59
(0.850)
1.91
(0.075)
3.43
(0.135)
1.09 DIA.
(0.043)
TYP.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CYG2110-R02
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
