DMP2540UCB9
Document number: DS35611 Rev. 5 - 2
May 2015
© Diodes Incorporated
ADVA N C E INF O RMA TION
Maximum Ratings (@T
A
= +25°C unless otherwise specified.)
Continuous Drain Current (Note 5) V
GS
= -4.5V
Continuous Drain Current (Note 6) V
GS
= -4.5V
Pulsed Drain Current (Pulse duration 10μs, duty cycle ≤1%)
Continuous Source Pin Current (Note 6)
Pulsed Source Pin Current (Pulse duration 10μs, duty cycle ≤1%)
Continuous Gate Clamp Current (Note 5)
Pulsed Gate Clamp Current (Pulse duration 10μs, duty cycle ≤1%)
Thermal Characteristics (@T
A
= +25°C unless otherwise specified.)
Total Power Dissipation (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Ambient (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics (@T
A
= +25°C unless otherwise specified.)
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @T
C
= +25°C
ON CHARACTERISTICS (Note 7)
V
DS
= V
GS
, I
D
= -250μA
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 5)
V
dd
= –9.5V, I
F
= –2A, di/dt =
200A/μs
DYNAMIC CHARACTERISTICS (Note 8)
V
DS
= -10V, V
GS
= 0V,
f = 1.0MHz
Reverse Transfer Capacitance
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
V
GS
= -4.5V, V
DS
= -10V,
I
D
= -2A
V
DD
= -10V, V
GS
= -4.5V,
I
DS
= -2A, R
G
= 2Ω,
Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout.
6. Device mounted on FR4 material with 1-inch
2
(6.45-cm
2
), 2-oz. (0.071-mm thick) Cu
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.