BLF4G20LS-130_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 1 June 2007 7 of 11
NXP Semiconductors
BLF4G20LS-130
UHF power LDMOS transistor
8. Test information
[1] American Technical Ceramics type 100B or capacitor of same quality.
Striplines are on a double copper-clad Taconic RF35 Printed-Circuit Board (PCB) (ε
r
= 3.5); thickness = 0.76 mm.
See Table 8 for list of components.
Fig 9. Component layout for 1930 MHz to 1990 MHz production test circuit
001aag534
BLF4G20LS-130
input - PCS rev. 1
C3
C1
C2
BLF4G20LS-130
output - PCS rev. 1
C7
C10
C5
C9
W1
VDD
C6
C4
R1
Table 8. List of components (see Figure 9)
Component Description Value Dimensions Remarks
C1, C3, C5, C7 chip capacitor 11 pF
[1]
C2, C9 tantalum capacitor 10 µF
C4 chip capacitor 0.8 pF
[1]
C6 chip capacitor 0.1 pF
[1]
C8 American Technical Ceramics
(ATC) chip capacitor
1 µF 1812X7R105KL2AB
C10 Philips electrolytic capacitor 220 µF; 35 V
R1 Philips chip resistor 5.1 Ω 0603
W1 hand made wire 5 mm
