CRCW01005 e3
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Revision: 06-Nov-13
3
Document Number: 20056
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All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
Stability for product types:
1 to 1 M
CRCW01005 e3
4.5 - Resistance - ± 1 %; ± 2 %; ± 5 %
4.13 - Short time overload
U = 2.5 x 2 x U
max.
;
duration according to style
± (2 % R + 0.1 )
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(235 ± 3) °C
(2 ± 0.5) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient
(20/-55/20) °C and
(20/125/20) °C
- 200 ppm/K/+600 ppm/K,
± 250 ppm/K
4.33 21 (Uu
1
) Substrate bending Depth 3 mm; 1 time
No visible damage,
no open circuit in bent position
± (1 % R + 0.05 )
4.19 14 (Na)
Rapid change
of temperature
15 min. at -55 °C;
15 min. at 125 °C;
300 cycles
± (2 % R + 0.1 )
4.25.1 - Endurance at 70 °C
U = U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (5 % R + 0.1 )
4.18.2 58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) °C; (10 ± 1) s
± (2 % R + 0.1 )
4.24 78 (Cab) Damp heat, steady state
(40 ± 2) °C; (90 to 95) % RH;
1000 h
± (5 % R + 0.1 )
4.25.3 -
Endurance at upper
category temperature
125 °C, 1000 h ± (2 % R + 0.1 )
4.29 45 (XA)
Component
solvent resistance
Isopropyl alcohol;
(20 to 25) °C; (5 ± 0.5) min
No visible damage